Semiconductor device and method of manufacturing the same

ABSTRACT

The method includes the steps of forming an upper electrode of a capacitor by patterning a second conductive film; forming a capacitor dielectric film by patterning a ferroelectric film; and forming a lower electrode by patterning a first conductive film. A step of forming the first conductive film includes the steps of forming a lower conductive layer made of a noble metal other than iridium over a first interlayer insulating film; and forming an upper conductive layer made of a conductive material, which is different from a material for the lower conductive layer, and which is other than platinum.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority of Japanese PatentApplication No.2006-231966 filed on Aug. 29, 2006, the entire contentsof which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method ofmanufacturing the same.

2. Description of the Related Art

In recent years, with the evolution of digital technology, nonvolatilememories have been developed, in which a large volume of data can bestored fast.

As such nonvolatile memories, a flash memory and a ferroelectric memoryare known.

Of these, the flash memory has a floating gate buried in a gateinsulating film of an insulated-gate field-effect transistor (IGFET).The flash memory accumulates charge representing information to bestored, in this floating gate, thus storing the information. However, insuch a flash memory, tunnel current needs to be passed through the gateinsulating film when information is written or deleted. For this reason,such a flash memory has a disadvantage that relatively high voltage isrequired.

On the other hand, the ferroelectric memory is also called aferroelectric random access memory (FeRAM), and stores information byutilizing hysteresis characteristics of a ferroelectric film provided ina ferroelectric capacitor. The ferroelectric film is polarized inresponse to a voltage applied between upper and lower electrodes of thecapacitor, and a spontaneous polarization remains therein even when thevoltage is removed. When the polarity of the applied voltage isreversed, this spontaneous polarization is also reversed. Information iswritten to the ferroelectric film with the orientation of thespontaneous polarization corresponding to “1” or “0.” Voltage needed forthis writing is lower than in flash memories. Moreover, the FeRAM has anadvantage that faster writing can be performed than that in flashmemories.

By utilizing this advantage, studies are being performed on applicationsof memory/logic mixed chips (SOC, system on chip), in which a logiccircuit and an FeRAM are combined, to IC cards.

Different combinations of a lower electrode and the ferroelectric film,which constitute a ferroelectric capacitor, show different degrees ofmatching. Accordingly, ferroelectric characteristics of theferroelectric capacitor greatly depend on the structure of the lowerelectrode.

For example, Japanese Unexamined Patent Application Publication No.2005-159165 proposes that an IrO₂/Ir/TiAlN/TiN stack structure isemployed as a lower electrode.

Moreover, Japanese Unexamined Patent Application Publication No.2000-91539 proposes that an IrO₂ film, an Ir film, and a Pt film areformed in this order as a lower electrode.

Additionally, Japanese Unexamined Patent Application Publication No.2004-95638 discloses that an Ir film and a Pt film are formed in thisorder as a lower electrode.

Furthermore, Japanese Unexamined Patent Application Publication No.2000-164818 discloses that the fatigue resistance of PZT on a lowerelectrode is improved by forming a film stack including a Pt film and anIr film as the lower electrode.

In addition, Japanese Unexamined Patent Application Publication No.2003-298136 explains that it is preferable to employ a stack structureof Ir/Pt/Ir, Ir/Pt, Pt/Ir or the like as a lower electrode.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a semiconductor deviceis provided. The semiconductor device includes a first interlayerinsulating film, a lower electrode, a capacitor dielectric film and anupper electrode. The first interlayer insulating film is formed over asemiconductor substrate. The lower electrode is formed over the firstinterlayer insulating film. The capacitor dielectric film is formed onthe lower electrode, and is made of a ferroelectric material. The upperelectrode is formed on the capacitor dielectric film. The lowerelectrode includes a lower conductive layer and an upper conductivelayer. The lower conductive layer is made of a noble metal other thaniridium. The upper conductive layer is formed on the lower conductivelayer, and is made of a conductive material, which is different from amaterial for the lower conductive layer, and which is other thanplatinum.

In addition, according to another aspect of the present invention, amethod of manufacturing a semiconductor device is provided. The methodincludes the steps of forming a first interlayer insulating film over asemiconductor substrate; forming a first conductive film over the firstinterlayer insulating film; forming a ferroelectric film on the firstconductive film; forming a second conductive film on the ferroelectricfilm; forming an upper electrode of a capacitor by patterning the secondconductive film; forming a capacitor dielectric film by patterning theferroelectric film; and forming a lower electrode of the capacitor bypatterning the first conductive film. The step of forming the firstconductive film includes the steps of forming a lower conductive layer,made of a noble metal other than iridium, over the first interlayerinsulating film; and forming an upper conductive layer on the lowerconductive layer. The upper conductive layer is made of a conductivematerial, which is different from a material for the lower conductivelayer, and which is other than platinum.

According to the present invention, the first conductive film, whichbecomes the lower electrode of the capacitor, is formed to have atwo-layer structure including the lower and upper conductive layers.

Of these, the lower conductive layer is made of a noble metal other thaniridium. On the other hand, the upper conductive layer is formed of aconductive material, which is different from the material for the lowerconductive layer, and which is other than platinum. A reason forexcluding platinum from the materials for the upper electrode is toprevent the capacitor dielectric film from deteriorating due to areaction between the material constituting the capacitor dielectric filmand platinum. Moreover, the use of expensive platinum for the upperconductive layer is not preferable also from the viewpoint of reducingthe cost of a semiconductor device.

By giving such a two-layer structure to the first conductive film, theproportion of the material such as iridium for the upper conductivelayer in the first conductive film is reduced compared with that in acase where the first conductive film is formed only of the material forthe upper conductive layer. Accordingly, in the step of forming thelower electrode by patterning the first conductive film by etching, theamount of the material for the upper conductive layer, which isscattered as grains from the first conductive film, e.g., the number ofiridium grains, is reduced. This reduces the number of grains of thematerial adhering again to side surfaces of the capacitor dielectricfilm. Accordingly, leakage paths are prevented from being formed byadhered iridium grains or the like. As a result, it becomes possible toprovide a semiconductor device having low leakage current and improvedelectrical characteristics.

Furthermore, by forming the lower conductive layer thicker than theupper conductive layer in the step of forming the lower conductivelayer, the proportion of the material constituting the upper conductivelayer in the first conductive film is not more than half. Accordingly,the number of material grains, adhering to the side surfaces of theabove-described capacitor dielectric film, is further reduced, and itbecomes possible to more effectively reduce the leakage current of thecapacitor.

Here, in the step of forming the lower conductive layer, it ispreferable to form a platinum film as the lower conductive layer bysputtering at a substrate temperature of not less than 250° C. nor morethan 450° C. Additionally, in the step of forming the upper conductivelayer, it is preferable to form an iridium film as the upper conductivelayer by sputtering at a substrate temperature of not less than 400° C.nor more than 550° C.

Forming the lower and upper conductive layers respectively in suchtemperature ranges reduces the stress of each layer simultaneously toprevent film delamination in these layers, and can also improve thecrystallinity of each layer.

Furthermore, after the upper conductive layer is formed, the firstconductive film may be annealed in an inert gas atmosphere. Suchannealing improves the adhesion between the first conductive film and afilm thereunder, and also improves the crystallinity of the firstconductive film.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a TEM cross-sectional image and EDX spectra (part 1) of asample used in a research conducted by the inventor of the presentapplication.

FIG. 2 shows a TEM cross-sectional image and EDX spectra (part 2) of thesample used in the research conducted by the inventor of the presentapplication.

FIGS. 3A to 3W are cross-sectional views of a semiconductor deviceaccording to a first embodiment of the present invention in the processof being manufactured.

FIGS. 4A to 4L are cross-sectional views of a semiconductor deviceaccording to a second embodiment of the present invention in the processof being manufactured.

FIG. 5 is a cross-sectional view of a semiconductor device according toa third embodiment of the present invention.

FIGS. 6A to 6O are cross-sectional views of a semiconductor deviceaccording to a fourth embodiment of the present invention in the processof being manufactured.

FIGS. 7A to 7N are cross-sectional views of a semiconductor deviceaccording to a fifth embodiment of the present invention in the processof being manufactured.

FIGS. 8A to 8J are plan views of the semiconductor device according tothe fifth embodiment of the present invention in the process of beingmanufactured.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Next, embodiments of the present invention will be described in detailwith reference to the accompanying drawings.

(1) Description of Research Results

Prior to embodiments of the present invention, a research conducted bythe inventor of the present application will be described.

The drawing on the left side of FIG. 1 is a transmission electronmicroscope (TEM) cross-sectional image of a sample used in the research.

This sample is made by forming stacked capacitors Q on an underlyinginsulating film 100 made of a silicon oxide (SiO₂) film. In thisdrawing, side surfaces of the capacitors Q are enlarged. The capacitor Qincludes a conductive oxygen barrier film 101 made of a titaniumaluminum nitride (TiAlN) film, a lower electrode 102 made of an iridiumfilm, and a capacitor dielectric film 103 made of PZT.

For an upper electrode 104 of this capacitor Q, a two-layer structurewas employed, which included a conductive metal oxide film 104 a made ofan iridium oxide film, and a conductivity-improving film 104 b made ofan iridium film.

The conductive metal oxide film 104 a made of iridium oxide has thefunction of blocking hydrogen from entering the capacitor Q from outsideby the action of oxygen in the conductive metal oxide film 104 a.Hydrogen can reduce and deteriorate the capacitor dielectric film 103.

The conductivity-improving film 104 b has the function of reducing thecontact resistance to a conductive plug (not shown) formed on the upperelectrode 104.

Furthermore, this capacitor Q was covered with a capacitor protectioninsulating film 106 made of alumina which has an excellent ability toprevent the permeation of hydrogen. Moreover, an interlayer insulatingfilm 107 made of silicon oxide was formed on the capacitor protectioninsulating film 106.

In this example, the lower electrode 102, the capacitor dielectric film103, and the upper electrode 104 were formed by simultaneous etching.The capacitor Q formed by such simultaneous etching is also called astacked capacitor, and is advantageous in improving packaging densitybecause of its small occupying area.

It should be noted that methods of forming the capacitor Q which areemployed in mass-production processes include, other than suchsimultaneous etching, a method in which the lower electrode 102, thecapacitor dielectric film 103, and the upper electrode 104 areseparately patterned to be formed in tiers (e.g., see FIGS. 2 to 12 ofJapanese Unexamined Patent Application Publication No. 2003-298136).Such a tier capacitor is also called a planar capacitor.

Here, according to the research conducted by the inventor of the presentapplication, in the stacked capacitor Q formed by simultaneous etchingsuch as described above, the leakage current between the lower and upperelectrodes 102 and 104 became approximately two to three orders ofmagnitude larger.

The inventor of the present application observed the above-described TEMimage in detail in order to search for reasons for the increase in theleakage current of the capacitor Q. As a result, the inventor discoveredthat many white grains existed on a side surface of the capacitordielectric film 103.

Then, these white grains were investigated with an energy dispersiveX-ray fluorescence spectrometer (EDX), and the graph shown in the upperright of FIG. 1 was obtained.

As shown in this graph, many peaks indicating the existence of iridiumappeared.

A position without white grains was investigated with the EDX forcomparison purposes, and the graph shown in the lower right of FIG. 1was obtained. It was found that iridium does not exist at the positionwithout white grains.

From this result, it was confirmed that the white grains were iridiumgrains.

The iridium grains are considered to be those scattered from sidesurfaces of the lower electrode 102 made of an iridium film at the timeof forming the capacitor Q by the simultaneous etching, in which theside surfaces of the lower electrode 102 are exposed to an etchingatmosphere.

Since the iridium grains form leakage paths of the capacitor Q, thereduction of iridium grains is considered effective in reducing theleakage current.

It should be noted, however, that since iridium is difficult to bewet-etched compared with other platinum-group elements, iridium grainsneed to be removed without resort to wet etching.

Moreover, the inventor of the present application also investigatedwhite grains adhering to a side surface of the conductive oxygen barrierfilm 101 of the above-described sample with the EDX.

The result is shown in FIG. 2.

The graph in the upper right of FIG. 2 was obtained by investigatingwhite grains near the side surface of the conductive oxygen barrier film101 with the EDX. On the other hand, the graph in the lower rightthereof was obtained by investigating a position without white grains.

As apparent from comparing these two graphs, iridium peaks appear at theposition where the white grains are present in the graph, whereas thepeaks do not appear at the position where the white grains are absent.

Based on the above-described research results, the inventor of thepresent application conceived the following embodiments of the presentinvention.

(2) First Embodiment

FIGS. 3A to 3W are cross-sectional views of a semiconductor deviceaccording to this embodiment in the process of being manufactured.

This semiconductor device is a stacked FeRAM advantageous inminiaturization, and is fabricated as follows.

At the beginning, steps for obtaining the cross-sectional structureshown in FIG. 3A will be described.

First, in a surface of an n- or p-type silicon (semiconductor) substrate1, a trench for shallow trench isolation (STI) which delimits an activearea for transistors is formed. The inside of the trench is then filledwith an insulating film made of silicon oxide or the like. Thisinsulating film is used as an element isolation insulating film 2. Itshould be noted that an element isolation structure is not limited toSTI and that the element isolation insulating film 2 may be formed bylocal oxidation of silicon (LOCOS).

Next, a p-type impurity is introduced into the active area of thesilicon substrate 1 to form a p-well 3. Then, the surface of the activearea is thermally oxidized, and thereby a thermally oxidized film whichbecomes gate insulating films 4 is formed.

Subsequently, an amorphous or polycrystalline silicon film is formedover the entire upper surface of the silicon substrate 1. These filmsare patterned by photolithography, and thus two gate electrodes 5 areformed.

On the p-well 3, the above-described two gate electrodes 5 are arrangedin parallel apart from each other. These gate electrodes 5 constituteportions of word lines.

Then, an n-type impurity is introduced into the silicon substrate 1beside the gate electrodes 5 by ion implantation using the gateelectrodes 5 as a mask, and thus first and second source/drainextensions 6 a and 6 b are formed.

Thereafter, an insulating film is formed over the entire upper surfaceof the silicon substrate 1. This insulating film is etched back, andthus insulating sidewalls 7 are formed on side surfaces of the gateelectrodes 5. As the insulating film, for example, a silicon oxide filmis formed by CVD.

Subsequently, ions of an n-type impurity are again implanted into thesilicon substrate 1 using the insulating sidewalls 7 and the gateelectrodes 5 as a mask, whereby first and second source/drain regions(first and second impurity diffusion regions) 8 a and 8 b apart fromeach other are formed in the surface layer of the silicon substrate 1beside the two gate electrodes 5.

By the steps described so far, first and second MOS transistors TR₁ andTR₂ including the gate insulating films 4, the gate electrodes 5, andthe first and second source/drain regions 8 a and 8 b are formed in theactive area of the silicon substrate 1.

Next, a refractory metal layer such as a cobalt layer is formed over theentire upper surface of the silicon substrate 1 by sputtering. Then,this refractory metal layer is heated to be reacted with silicon, andthus a refractory metal silicide layer 9 is formed on the siliconsubstrate 1. The refractory metal silicide layer 9 is also formed insurface layer portions of the gate electrodes 5, whereby the resistancesof the gate electrodes 5 are reduced.

Thereafter, unreacted portions of the refractory metal layer on theelement isolation insulating film 2 and the like are removed by wetetching.

Subsequently, a silicon nitride (SiN) film is formed over the entireupper surface of the silicon substrate 1 to a thickness of approximately200 nm by plasma CVD. The silicon nitride film is used as a coverinsulating film 10. Then, a silicon oxide film is formed as a firstinterlayer insulating film 11 on this cover insulating film 10 to athickness of approximately 1000 nm by plasma CVD using TEOS gas.

Next, the upper surface of the first interlayer insulating film 11 ispolished and planarized by chemical mechanical polishing (CMP). As aresult of this CMP, the thickness of the first interlayer insulatingfilm 11 becomes approximately 700 nm on the flat surface of the siliconsubstrate 1.

Subsequently, the cover insulating film 10 and the first interlayerinsulating film 11 are patterned by photolithography, and thus contactholes each having a diameter of 0.25 μm are formed over the first andsecond source/drain regions 8 a and 8 b. Furthermore, a glue film(adhesion film) and a tungsten film are formed in this order in thesecontact holes. Then, unnecessary portions of the glue film and thetungsten film on the first interlayer insulating film 11 are polishedand removed by CMP in a way that these films are left only in thecontact holes as first and second conductive plugs 32 a and 32 b.

These first and second conductive plugs 32 a and 32 b are electricallyconnected respectively to the first and second source/drain regions 8 aand 8 b.

It should be noted that the above-described glue film is made by forminga titanium film having a thickness of approximately 30 nm and a titaniumnitride film having a thickness of approximately 20 nm in this order.Moreover, the tungsten film before applying the CMP thereto has athickness of approximately 300 nm on the first interlayer insulatingfilm 11.

Here, the first and second conductive plugs 32 a and 32 b consistprimarily of tungsten, which is prone to oxidation. The oxidation of thefirst and second conductive plugs 32 a and 32 b during the process maycause a contact failure.

Accordingly, as an anti-oxidation insulating film 14 for preventing theoxidation of the conductive plugs 32 a and 32 b, a silicon oxynitride(SiON) film is formed on these plugs 32 a and 32 b and the firstinterlayer insulating film 11 to a thickness of approximately 200 nm byplasma CVD.

It should be noted that instead of the silicon oxynitride film, asilicon nitride (SiN) film or an alumina film may be formed as theanti-oxidation insulating film 14.

Thereafter, a silicon oxide film is formed on the anti-oxidationinsulating film 14 to a thickness of approximately 300 nm by plasma CVDusing TEOS gas. This silicon oxide film is used as an underlyinginsulating film 15.

Next, steps for obtaining the cross-sectional structure shown in FIG. 3Bwill be described.

First, the underlying insulating film 15 and the anti-oxidationinsulating film 14 are patterned, and thereby first holes 15 a areformed in these insulating films respectively over the first conductiveplugs 32 a.

Subsequently, a titanium nitride film is formed as a glue film 35 on theinner surfaces of these first holes 15 a and on the underlyinginsulating film 15 by sputtering.

Furthermore, a tungsten film is formed as a plug conductive film 36 onthis glue film 35 by CVD, whereby the first holes 15 a are fully filledwith this plug conductive film 36.

Then, as shown in FIG. 3C, unnecessary portions of the glue film 35 andthe plug conductive film 36 on the underlying insulating film 15 arepolished and removed by CMP. Accordingly, the glue film 35 and the plugconductive film 36 are left in the first holes 15 a as third conductiveplugs 36 a electrically connected to the first conductive plugs 32 a.

In this CMP, used is such slurry that the polishing speeds of the gluefilm 35 and the plug conductive film 36 to be polished become fasterthan that of the underlying insulating film 15, e.g., W2000 manufacturedby Cabot Microelectronics Corporation. Moreover, in order to preventunpolished portions from being left on the underlying insulating film15, the polishing amount of this CMP is set larger than the totalthickness of the films 35 and 36. Thus, this CMP is over polishing.

Next, as shown in FIG. 3D, the underlying insulating film 15 made ofsilicon oxide is exposed to a nitrogen-containing plasma, e.g., anammonia (NH₃) plasma. Accordingly, NH groups are bonded to oxygen atomson the surface of the underlying insulating film 15.

In this ammonia plasma treatment, for example, a parallel-plate plasmatreatment system is used which has a counter electrode at a distance ofapproximately 9 mm (350 mils) from the silicon substrate 1. While thesubstrate temperature is being maintained at 400° C. at a pressure of266 Pa (2 Torr), ammonia gas is supplied to the inside of a chamber at aflow rate of 350 sccm. The treatment is performed by supplying ahigh-frequency power of 100 W at 13.56 MHz to the silicon substrate 1and a high-frequency power of 55 W at 350 kHz to the above-describedcounter electrode for 60 seconds.

Subsequently, as shown in FIG. 3E, a titanium film is formed on theunderlying insulating film 15 and the third conductive plugs 36 a to athickness of approximately 20 nm. This titanium film is used as acrystalline conductive film 21.

Deposition conditions for this crystalline conductive film 21 are notparticularly limited. In this embodiment, a sputtering chamber is used,in which the distance between the silicon substrate 1 and a titaniumtarget is set at 60 mm, and the substrate temperature is set at 20° C.in an argon atmosphere at 0.15 Pa. The crystalline conductive film 21made of titanium is formed by supplying a DC power of 2.6 kW to thechamber for five seconds.

Here, ammonia plasma treatment (see FIG. 3D) has been performed inadvance, and NH groups have been bonded to oxygen atoms on the surfaceof the underlying insulating film 15. Accordingly, titanium atomsdeposited on the underlying insulating film 15 are less prone to becaptured by oxygen atoms on the surface of the underlying insulatingfilm 15. For this reason, the titanium atoms can freely move on thesurface of the underlying insulating film 15, and it becomes possible toform the crystalline conductive film 21 made of titanium which isstrongly self-assembled in the (002) direction.

It should be noted that a material for the crystalline conductive film21 is not limited to titanium. The crystalline conductive film 21 may bemade of any one of titanium, platinum, iridium, rhenium, ruthenium,palladium, and osmium, or an alloy of any thereof.

Thereafter, rapid thermal anneal (RTA) in which the substratetemperature and the treatment time are respectively set at 650° C. and60 seconds, is performed on the crystalline conductive film 21 in annitrogen atmosphere. Accordingly, the crystalline conductive film 21made of titanium is nitrided, and the crystalline conductive film 21 ismade of titanium nitride oriented in the (111) direction.

Next, as shown in FIG. 3F, a titanium aluminum nitride (TiAlN) film isformed as a conductive oxygen barrier film 22 on this crystallineconductive film 21 to a thickness of 100 nm by reactive sputtering.

The conductive oxygen barrier film 22 made of titanium aluminum nitrideis excellent in the function of preventing oxygen permeation, and has arole of preventing the third conductive plugs 36 a thereunder from beingoxidized and causing a contact failure.

Deposition conditions for this conductive oxygen barrier film 22 are notparticularly limited. In this embodiment, a target made of an alloy oftitanium and aluminum is used, and a gas mixture of argon gas andnitrogen gas is used as sputtering gas. The flow rates of the argon gasand the nitrogen gas are set respectively at 40 sccm and 100 sccm, andthe conductive oxygen barrier film 22 is formed at a pressure of 253.3Pa, a substrate temperature of 400° C., and a sputtering power of 1.0kW.

Moreover, the conductive oxygen barrier film 22 is not limited to atitanium aluminum nitride film. As the conductive oxygen barrier film22, an iridium film or a ruthenium film can also be formed.

Next, as shown in FIG. 3G, a platinum film is formed as a lowerconductive layer 23 b of a first conductive film on the conductiveoxygen barrier film 22 to a thickness of approximately 60 nm bysputtering. The platinum film is formed, for example, in an argonatmosphere at a pressure of 0.2 Pa by setting the substrate temperatureat 400° C. and the sputtering power at 0.5 kW.

It should be noted that a material for this lower conductive layer 23 bis not particularly limited as long as it is a noble metal other thaniridium. The lower conductive layer 23 b may be formed of rhodium orpalladium.

Subsequently, as shown in FIG. 3H, an iridium film is formed on thelower conductive layer 23 b to a thickness of 40 nm. This iridium filmis used as an upper conductive layer 23 c of the first conductive film.Deposition conditions for this iridium film are not particularlylimited. In this embodiment, the following conditions are employed: anargon atmosphere at a pressure of 0.11 Pa, a substrate temperature of500° C. and a sputtering power of 0.3 kW.

Furthermore, a conductive material constituting the upper conductivelayer 23 c is not limited to iridium, and may be any one of ruthenium,iridium oxide, ruthenium oxide, and SrRuO₃.

Accordingly, the first conductive film 23 including the lower and upperconductive layers 23 b and 23 c is formed.

The crystallinity of the first conductive film 23 greatly affects theorientation of a ferroelectric film to be formed thereon later.Accordingly, respective deposition temperatures for the lower and upperconductive layers 23 b and 23 c are preferably set as high as possibleto improve the crystallinity of the first conductive film 23, and tothus improve the orientation of the ferroelectric film.

It should be noted, however, that if the deposition temperatures are toohigh, the stress of each of the lower and upper conductive layers 23 band 23 c becomes high, and film delamination may occur in the layers 23b and 23 c.

Accordingly, as a substrate temperature for depositing each of thelayers 23 b and 23 c, a temperature is preferably employed which is ashigh as possible and at which stress becomes small.

In a case where a platinum film is formed as the lower conductive layer23 b, a temperature range in which the stress of the lower conductivelayer 23 b becomes small is 280° C. to 300° C. Accordingly, the lowerconductive layer 23 b is preferably formed at a substrate temperature ofnot less than 250° C. nor more than 450° C., which includes theabove-described temperature range, in which the upper limit is shiftedhigher.

On the other hand, in a case where an iridium film is formed as theupper conductive layer 23 c, a temperature range in which the stress ofthe upper conductive layer 23 c becomes small is 420° C. to 450° C.Accordingly, the upper conductive layer 23 c is preferably formed at asubstrate temperature of not less than 400° C. nor more than 550° C.,which includes the above-described temperature range, in which the upperlimit is shifted higher.

Employing such temperature ranges makes it possible to improve thecrystallinity of the first conductive film 23 while preventing filmdelamination in the layers 23 b and 23 c.

Here, as described previously, the titanium nitride film constitutingthe crystalline conductive film 21 is oriented in the (111) direction.Accordingly, the crystallinity of the first conductive film 23 becomesmore favorable also by the action of this orientation.

Thereafter, in an argon atmosphere, RTA in which the substratetemperature is set at a temperature of not less than 650° C. isperformed on the first conductive film 23 for 60 seconds. As a result,the adhesion between the films 21 to 23 is enhanced, and also thecrystallinity of the first conductive film 23 is improved.

The atmosphere for this RTA is not particularly limited as long as it isan inert gas atmosphere. Such inert gases include nitrogen gas and N₂Ogas other than argon gas.

Subsequently, as shown in FIG. 3I, a lead zirconate titanate (PZT,PbZrTiO₃) film having a perovskite structure is formed on the firstconductive film 23 by MOCVD. This PZT film is used as a firstferroelectric film 24 b. The first ferroelectric film 24 b formed byMOCVD has already been crystallized at the time of deposition.Accordingly, crystallization annealing for crystallizing the firstferroelectric film 24 b is unnecessary.

The MOCVD is performed as follows.

First, each of Pb(DPM)₂ (chemical formula is Pb(C₁₁H₁₉O₂)₂), Zr(dmhd)₄(chemical formula is Zr(C₉H₁₅O₂)₄), and Ti(O-iOr)₂(DPM)₂ (chemicalformula is Ti(C₃H₇O)₂(C₁₁H₁₉O₂)₂) is dissolved in a tetra hydro furan(THF, C₄H₈O) solvent at a concentration of 0.3 mol/l, and thusrespective liquid raw materials of Pb, Zr and Ti are prepared. Then,these liquid raw materials are supplied to a vaporizer of an MOCVDsystem respectively at flow rates of 0.326 ml/min, 0.200 ml/min, and0.200 ml/min to be vaporized, and thus a raw material gas containing Pb,Zr and Ti is obtained. It should be noted that to the above-describedvaporizer, a THF solvent is also supplied at a flow rate of 0.474 ml/mintogether with the liquid raw materials.

Furthermore, while the above-described raw material gas is beingsupplied to the chamber, the pressure in the chamber is set at 665 Pa (5Torr) and the substrate temperature is maintained at 620° C. Bymaintaining such a state for 620 seconds, the above-described PZT filmis formed to a thickness of 100 nm.

It should be noted that the first ferroelectric film 24 b is not limitedto a PZT film. The first ferroelectric film 24 b may be made of amaterial obtained by doping PZT with at least one of lanthanum, calcium,strontium, and silicon. Each of these materials has a perovskitestructure. Accordingly, when the upper conductive layer 23 c under thefirst ferroelectric film 24 b is made of SrRuO₃ having a perovskitestructure, the lattice matching between the upper conductive layer 23 cand the first ferroelectric film 24 b becomes favorable, and thecrystallinity of the first ferroelectric film 24 b is enhanced.

It should be noted that the first ferroelectric film 24 b may be formedof a Bi layered compound such as (Bi_(1-x)R_(x))Ti₃O₁₂ (R is arare-earth element, and 0<x<1), SrBi₂Ta₂O₉, or SrBi₄Ti₄O₁₅.

Moreover, the first ferroelectric film 24 b may be formed of ahigh-dielectric metal oxide material containing zirconium or lead,instead of a ferroelectric material.

Here, as described previously, the crystallinity of the first conductivefilm 23 is favorable by the action of the crystalline conductive film 21made of titanium nitride oriented in the (111) direction. Accordingly,the crystallinity of the first ferroelectric film 24 b formed on thefirst conductive film 23 also becomes favorable. Accordingly,ferroelectric characteristics, e.g., the remanent polarization chargeamount, of the first ferroelectric film 24 b are improved.

Next, a PZT film is formed as a second ferroelectric film 24 c on thefirst ferroelectric film 24 b to a thickness of 1 to 30 nm, e.g., to athickness of 20 nm, by sputtering. These first and second ferroelectricfilms 24 b and 24 c are used as a ferroelectric film 24.

It should be noted that unlike the first ferroelectric film 24 b formedby MOCVD, the second ferroelectric film 24 c formed by sputtering is notcrystallized but in an amorphous state, at the time of deposition.

Moreover, the second ferroelectric film 24 c is not limited to PZT.

The second ferroelectric film 24 c may be made of a ferroelectricmaterial having an ABO₃ perovskite structure (A=any one of Bi, Pb, Ba,Sr, Ca, Na, K and rare-earth elements; B=any one of Ti, Zr, Nb, Ta, W,Mn, Fe, Co and Cr) similarly to PZT.

Furthermore, the second ferroelectric film 24 c may be made of amaterial obtained by doping PZT with at least one of lanthanum, calcium,strontium, and silicon. Doping a PZT film with these elements improvesthe fatigue loss and imprint characteristics of the second ferroelectricfilm 24 c, and can lower a write voltage and a read voltage applied to acapacitor.

Alternatively, the second ferroelectric film 24 c may be made of a Bilayered compound such as (Bi_(1-x)R_(x))Ti₃O₁₂ (R is a rare-earthelement, and 0<x<1), SrBi₂Ta₂O₉, or SrBi₄Ti₄O₁₅.

Moreover, a method of depositing the second ferroelectric film 24 c isalso not limited to sputtering. The second ferroelectric film 24 c maybe formed by the sol-gel method or MOCVD. In a case where MOCVD isemployed, conditions similar to those for the first ferroelectric film24 b can be employed as deposition conditions for the secondferroelectric film 24 c.

It should be noted, however, that for an undermentioned reason, thesecond ferroelectric film 24 c is preferably a film in an amorphousstate or a film made of microcrystals. It is most preferable to employsputtering by which the second ferroelectric film 24 c that is amorphouscan be deposited.

Subsequently, as shown in FIG. 3J, while the silicon substrate 1 isbeing heated, an iridium oxide (IrO_(x)) film is formed as a firstconductive metal oxide film 25 d on the ferroelectric film 24 to athickness of approximately 50 nm by reactive sputtering. It should benoted that the iridium oxide film formed by sputtering in which thesilicon substrate 1 is heated as described above has already beencrystallized at the time of deposition even if a process forcrystallization is not performed.

Deposition conditions for the first conductive metal oxide film 25 d arenot particularly limited. In this embodiment, the substrate temperatureis set at 300° C.; a gas mixture of argon gas having a flow rate of 140sccm and oxygen gas having a flow rate of 10 to 90 sccm, e.g., 60 sccm,is used as sputtering gas; and the sputtering power is set at 1 kW to 2kW.

Here, in the above-described sputtering of iridium oxide, iridium atomsflying off an iridium target are oxidized in the sputtering atmosphere,whereby iridium oxide is deposited on the substrate. Accordingly, partof the deposited iridium oxide is not sufficiently oxidized in theatmosphere. The iridium oxide film is, as a whole, prone to be in astate in which the amount of oxygen is smaller than in thestoichiometric composition (IrO₂).

Accordingly, when the chemical formula of iridium oxide of thestoichiometric composition is represented by IRO_(x1), x1 is 2.Meanwhile, in the first conductive metal oxide film 25 d formed underthe aforementioned conditions, when the chemical formula of iridiumoxide is represented by IrO_(x2), x2 is a value approximately between1.3 and 1.9. The ratio x2/x1 is considerably smaller than 1.

Here, the first ferroelectric film 24 b suffers damage from sputteringgas when the second ferroelectric film 24 c and the first conductivemetal oxide film 25 d are formed by sputtering. Moreover, theconcentration of oxygen in the first ferroelectric film 24 b isinsufficient, and ferroelectric characteristics thereof may bedeteriorated.

Accordingly, after the formation of the above-described first conductivemetal oxide film 25 d, RTA is performed in an oxidizing-gas-containingatmosphere, e.g., a mixed atmosphere of argon and oxygen. The damagesuffered by the first ferroelectric film 24 b from sputtering is thusrecovered, and oxygen deficiency in the first ferroelectric film 24 b iscompensated.

Conditions for this RTA are not particularly limited. However, thesubstrate temperature is preferably set at a temperature of not lessthan 650° C., more preferably 700° C. to 750° C. In this embodiment, thesubstrate temperature is set at 725° C. Moreover, the flow rates ofargon and oxygen are set respectively at 2000 sccm and 20 sccm, and thetreatment time is set at 60 seconds.

It should be noted that the atmosphere for this RTA is not particularlylimited as long as it is a mixed atmosphere of inert gas and oxidizinggas. As inert gas of these, any one of argon, nitrogen (N₂), andnitrogen dioxide can be employed.

Furthermore, since the second ferroelectric film 24 c is formed to beamorphous, iridium atoms which diffuse into the ferroelectric film 24from the first conductive metal oxide film 25 d due to this RTA remainin the second ferroelectric film 24 c, and become less prone to reachthe first ferroelectric film 24 b. As a result, iridium becomes lessprone to diffuse into grain boundaries of the first ferroelectric film24 which is crystallized to show excellent ferroelectriccharacteristics. Accordingly, leakage paths are prevented from beingformed by the iridium, and it becomes possible to effectively preventthe leakage current of a ferroelectric capacitor.

The above-described advantage can also be obtained when the secondferroelectric film 24 c is formed of a film made of microcrystals.

After the first conductive metal oxide film 25 d is formed as describedabove, an iridium oxide film is formed as a second conductive metaloxide film 25 e on the first conductive metal oxide film 25 d to athickness of approximately 100 to 300 nm, e.g., 200 nm, by reactivesputtering in which the substrate temperature is set at roomtemperature. The second conductive metal oxide film 25 e is formed in asputtering atmosphere at a pressure of 0.8 Pa by setting the sputteringpower at 1.0 kW and setting the deposition time at 79 seconds.

Here, unlike the first conductive metal oxide film 25 d crystallized ata high deposition temperature, the second conductive metal oxide film 25e formed by sputtering in which the substrate temperature is set at roomtemperature becomes in an amorphous state.

If the amount of oxygen is insufficient in the second conductive metaloxide film 25 e, the catalysis of the second conductive metal oxide film25 e is improved. Accordingly, external moisture touches the secondconductive metal oxide film 25 e, and thus hydrogen is generated. Sincehydrogen causes the problem that it reduces the ferroelectric film 24 todeteriorate ferroelectric characteristics thereof, the amount ofhydrogen generated needs to be made as small as possible in the processof manufacturing an FeRAM.

Accordingly, from the viewpoint of preventing the generation ofhydrogen, the oxidation number of iridium constituting the secondconductive metal oxide film 25 e is preferably larger than that of thefirst conductive metal oxide film 25 d.

For this reason, in this embodiment, by setting the ratio of the oxygenflow rate to the total flow rate of sputtering gas for forming thesecond conductive metal oxide film 25 e higher than that in the step offorming the first conductive metal oxide film 25 d, the composition ofiridium oxide is brought close to the stoichiometric composition (IrO₂)to suppress the catalysis of the second conductive metal oxide film 24e. With regard to the flow rates of sputtering gases at this time, forexample, the flow rate of argon is set at 100 sccm, and that of oxygenis set at 100 sccm.

When the chemical formula of iridium oxide constituting the secondconductive metal oxide film 24 e is represented by IrO^(y2), y2 isapproximately 2 in a case where the above-described conditions are met.When the chemical formula of iridium oxide of stoichiometric compositionis represented by IrO_(y1), y1 is 2. Accordingly, the ratio y2/y1 is avalue near 1, and the magnitude relationship with the ratio x2/x1 forthe first conductive metal oxide film 25 d is y2/y1>x2/x1.

The second conductive metal oxide film 25 e and the first conductivemetal oxide film 25 d described above form a conductive metal oxide film25 b such as shown in the drawing.

The first conductive metal oxide film 25 d has the function of blockinghydrogen by the action of oxygen in the film, and also has the role ofprotecting the capacitor dielectric film 24 from hydrogen.

It should be noted that a material for the first and second conductivemetal oxide films 25 d and 25 e is not limited to iridium oxide.

However, in a case where the first ferroelectric film 24 b is formed byMOCVD, if platinum oxide films are employed as the first and secondconductive metal oxide films 25 d and 25 e, lead of PZT constituting theferroelectric film 24 reacts with platinum. Accordingly, ferroelectriccharacteristics of the ferroelectric film 24 are deteriorated, and theremanent polarization charge amount of the ferroelectric film 24decreases. Thus, in this case, as a material for the first and secondconductive metal oxide films 25 d and 25 e, oxide of any one of iridium(Ir), ruthenium (Ru), rhodium (Rh), rhenium (Re), osmium (Os), andpalladium (Pd) is preferably employed.

It should be noted, however, that if the above-described reactionbetween lead of PZT and platinum is insignificant, platinum oxide filmsmay be employed as the first and second conductive metal oxide films 25d and 25 e.

Moreover, as described previously, in order to prevent the generation ofhydrogen in the second conductive metal oxide film 25 e, it ispreferable that the metal oxide constituting the second conductive metaloxide film 25 e be more oxidized than the first conductive metal oxidefilm 25 d. When the stoichiometric compositions of the metal oxidesconstituting the first and second conductive metal oxide films 25 d and25 e are represented respectively by AO_(x1) and BO_(y1) (A and B aremetal elements), and the actual compositions thereof after depositionare represented respectively by AO_(x2) and BO_(y2), the above-describedconditions are represented by y2/y1>x2/x1.

Furthermore, with regard to the thicknesses of the first and secondconductive metal oxide films 25 d and 25 e, it is preferable that thefirst conductive metal oxide film 25 d have a smaller thickness thanthat of the second conductive metal oxide film 25 e.

This is because of the following reason. In the aforementioned RTAperformed after the formation of the first conductive metal oxide film25 d, when the first conductive metal oxide film 25 d is thinner, oxygencan more easily spread over the entire ferroelectric film 24. As aresult, damage suffered by the ferroelectric film 24 can be effectivelyrecovered. Moreover, since the second conductive metal oxide film 25 ealso has the role of blocking moisture and reducing substances such ashydrogen from a second interlayer insulating film to be formed later, ifthe thickness of the second conductive metal oxide film 25 e is larger,the performance of blocking reducing substances is more improved.

Subsequently, as shown in FIG. 3K, an iridium film is formed as aconductivity-improving film 25 c on the conductive metal oxide film 25 bto a thickness of approximately 50 nm by sputtering. The sputtering isperformed in an argon atmosphere at a pressure of 1 Pa, and a sputteringpower of 1.0 kW is introduced into the sputtering atmosphere.

The conductivity-improving film 25 c and the conductive metal oxide film25 b thereunder constitute a second conductive film 25. Theconductivity-improving film 25 c has the role of compensating theconductivity of the second conductive film 25, which is prone to beinsufficient in a case where only the conductive metal oxide film 25 bis used. Moreover, the conductivity-improving film 25 c also has therole of blocking external hydrogen and preventing a deterioration of theferroelectric film 24 because iridium, which is a material for theconductivity-improving film 25 c, has excellent barrier propertiesagainst hydrogen.

It should be noted that instead of the iridium film, any one of aruthenium film, a rhodium film, and a palladium film may be formed asthe conductivity-improving film 25 c.

Thereafter, the back surface of the silicon substrate 1 is cleaned.

Next, as shown in FIG. 3L, a titanium nitride film is formed on thesecond conductive film 25 by sputtering. The titanium nitride film isused as a first mask material layer 26.

Furthermore, a silicon oxide film is formed as a second mask materiallayer 27 on the first mask material layer 26 by plasma CVD using TEOSgas.

Then, as shown in FIG. 3M, the second mask material layer 27 ispatterned into island-shaped portions, and thus a second hard mask 27 ais formed.

Next, steps for obtaining the cross-sectional structure shown in FIG. 3Nwill be described.

First, the first mask material layer 26 is etched using the second hardmask 27 a as a mask to form a first hard mask 26 a.

Subsequently, portions of the second conductive film 25, theferroelectric film 24, and the first conductive film 23, which are notcovered with the first and second hard masks 26 a and 27 a, aredry-etched to form capacitors Q each including a lower electrode 23 a, acapacitor dielectric film 24 a and an upper electrode 25 a.

Gas used in the dry etching is not particularly limited. A gas mixtureof HBr and oxygen is used as etching gas for the first and secondconductive films 23 and 25. On the other hand, a gas mixture of chlorineand argon is used as etching gas for the ferroelectric film 24.

Moreover, since the conductive oxygen barrier film 22 has etchingresistance to the etching gas for the first conductive film 23, theconductive oxygen barrier film 22 is left on the entire surface of thecrystalline conductive film 21 even after the capacitors Q are formed.

The lower electrodes 23 a of the capacitors Q formed as described aboveare electrically connected to the first conductive plugs 32 a throughthe conductive oxygen barrier film 22, the crystalline conductive film21, and the third conductive plugs 36 a.

Furthermore, since the ferroelectric film 24 and the first conductivefilm 23 are simultaneously etched as described previously, side surfacesof the capacitor dielectric films 24 a and the lower electrodes 23 aexist in the same planes.

Here, the first conductive film 23 formed into the lower electrodes 23 aby the above-described etching has a two-layer structure including thelower conductive layer 23 b made of platinum and the upper conductivelayer 23 c made of iridium. Accordingly, the proportion of iridium inthe first conductive film 23 is smaller than that in a case where thefirst conductive film 23 has a single-layer structure formed of only aniridium film.

Accordingly, in the aforementioned etching of the capacitors Q, thenumber of iridium grains scattered from the side surfaces of the lowerelectrodes 23 a into the etching atmosphere is reduced. This can reducethe number of iridium grains adhering to the side surfaces of thecapacitor dielectric films 24 a, and thus can prevent leakage paths frombeing formed between the lower and upper electrodes 23 a and 25 a by theiridium grains.

To effectively reduce the amount of iridium grains scattered, thethickness of each of the lower conductive layers 23 b is preferably madelarger than that of the corresponding upper conductive layer 23 c madeof iridium to reduce the proportion of the upper conductive layer 23 cin the corresponding lower electrodes 23 a. For example, each of thelower conductive layer 23 bs is preferably formed to a thickness one tonine times that of the corresponding upper conductive layer 23 c.

Subsequently, as shown in FIG. 30, the second hard mask 27 a made ofsilicon oxide is removed by wet etching using a mixed solution ofhydrogen peroxide (H₂O₂), ammonia, and moisture as an etchant. It shouldbe noted that the second hard mask 27 a may be removed by dry etching.

Next, steps for obtaining the cross-sectional structure shown in FIG. 3Pwill be described.

First, using the first hard mask 26 a (see FIG. 30) as a mask, thecrystalline conductive film 21 and the conductive oxygen barrier film 22are etched in a way that these films are left only under the capacitorsQ. This etching is performed by dry etching. As etching gas therefor,for example, a gas mixture of argon and chlorine is used.

Moreover, the first hard mask 26 a is also etched by this etching gas.Accordingly, when the etching is finished, the first hard mask 26 a isremoved.

Subsequently, as shown in FIG. 3Q, an alumina (Al₂O₃) film for coveringthe capacitors Q is formed to a thickness of approximately 20 nm. Thealumina film is used as a first capacitor protection insulating film 39.Alumina constituting the first capacitor protection insulating film 39has excellent ability to prevent the permeation of hydrogen.Accordingly, external hydrogen is blocked by this first capacitorprotection insulating film 39. Thus, the capacitor dielectric films 24 acan be prevented from being deteriorated by hydrogen.

Here, the capacitor dielectric films 24 a suffer damage due to the dryetching (see FIG. 30) performed at the time of the formation of thecapacitors Q and due to the deposition of the first capacitor protectioninsulating film 39 by sputtering.

Accordingly, in order to cause the capacitor dielectric films 24 a torecover from this damage, recovery annealing is performed on thecapacitor dielectric films 24 a in an oxygen-containing atmosphere asshown in FIG. 3R. Conditions for this recovery annealing are notparticularly limited. In this embodiment, the substrate temperature isset at 550° C. to 700° C., e.g., 650° C., in a furnace, and the recoveryannealing is performed for approximately 60 minutes.

Subsequently, as shown in FIG. 3S, an alumina film is formed on thefirst capacitor protection insulating film 39 to a thickness ofapproximately 20 nm by CVD. This alumina film is used as a secondcapacitor protection insulating film 40.

Next, steps for obtaining the cross-sectional structure shown in FIG. 3Twill be described.

First, a silicon oxide film is formed as a second interlayer insulatingfilm 41 on the second capacitor protection insulating film 40 by plasmaCVD using TEOS gas as reaction gas. In the reaction gas, oxygen gas andhelium gas are also contained. Additionally, the thickness of the secondinterlayer insulating film 41 is not particularly limited. In thisembodiment, the thickness thereof on the flat surface of the siliconsubstrate 1 is set at 1500 nm.

It should be noted that, instead of the silicon oxide film, aninsulating inorganic film may be formed as the second interlayerinsulating film 41.

Thereafter, the surface of the second interlayer insulating film 41 ispolished and planarized by CMP.

Furthermore, as treatment of dehydrating the second interlayerinsulating film 41, the surface of the second interlayer insulating film41 is exposed to a N₂O plasma. This N₂O plasma removes moistureremaining in the second interlayer insulating film 41, and preventsmoisture from being again absorbed by the second interlayer insulatingfilm 41.

It should be noted that N₂ plasma treatment may be performed as thisdehydrating treatment.

Subsequently, a flat alumina film is formed on the second interlayerinsulating film 41 to a thickness of approximately 20 nm to 100 nm bysputtering. The alumina film is used as a third capacitor protectioninsulating film 42. This third capacitor protection insulating film 42is formed on the second interlayer insulating film 41 which isplanarized, and therefore does not have to have excellent coveragecharacteristics and is formed by inexpensive sputtering as describedabove. It should be noted, however, that a method of depositing thethird capacitor protection insulating film 42 is not limited tosputtering and may be CVD.

Thereafter, as shown in FIG. 3U, a silicon oxide film is formed as a capinsulating film 43 on the third capacitor protection insulating film 42to a thickness of approximately 800 to 1000 nm by plasma CVD using TEOSgas. It should be noted that a silicon oxynitride film or a siliconnitride film may be formed as this cap insulating film 43.

Furthermore, CMP may be performed on this cap insulating film 43 toplanarize the surface thereof.

Next, steps for obtaining the cross-sectional structure shown in FIG. 3Vwill be described.

First, the first to third capacitor protection insulating films 39, 40,and 42, the second interlayer insulating film 41, and the cap insulatingfilm 43 are patterned, whereby second holes 41 a each having a depthwhich reaches the corresponding conductivity-improving film 25 c (seeFIG. 3K) are formed in these films on the upper electrodes 25 a.

Then, in order to recover damage suffered by the capacitor dielectricfilms 24 a in the foregoing steps, the silicon substrate 1 is placed inan unillustrated furnace, and recovery annealing in which the substratetemperature is set at 550° C. is performed in an oxygen atmosphere.

Next, the first to third capacitor protection insulating films 39, 40,42, the second interlayer insulating film 41, the cap insulating film43, the underlying insulating film 15, and the anti-oxidation insulatingfilm 14 on the second conductive plugs 32 b are patterned, and thusthird holes 41 b are formed in these films.

It should be noted that, when this patterning is performed, the secondholes 41 a are covered with a resist pattern, and are protected from theetching atmosphere by the resist pattern.

Here, if an attempt is made to simultaneously form these holes 41 a and41 b, the upper electrodes 25 a in the second holes 41 a are exposed tothe etching atmosphere for a long time until the third holes 41 b, whichare deeper, are formed, and the problem occurs that the capacitordielectric films 24 a deteriorate.

In this embodiment, since the second and third holes 41 a and 41 bhaving different depths from each other are separately formed asdescribed previously, such a problem can be avoided.

Furthermore, the second conductive plugs 32 b over the secondsource/drain regions 8 b are covered with the anti-oxidation insulatingfilm 14 until this step is finished. Accordingly, tungsten constitutingthe second conductive plugs 32 b is prevented from being oxidized andcausing a contact failure.

Subsequently, a titanium film and a titanium nitride film are formed inthis order as a glue film on the cap insulating film 43 and in thesecond and third holes 41 a and 41 b by sputtering.

It should be noted that the titanium nitride film may be formed byMOCVD. In this case, in order to remove carbon from the titanium nitridefilm, it is preferable to anneal the titanium nitride film in anatmosphere made by converting nitrogen and hydrogen into a plasma. Evenwhen annealing is performed in a hydrogen-containing atmosphere in thisway, the conductivity-improving films 25 c (see FIG. 3K) made of iridiumand formed in the uppermost layers of the upper electrodes 25 a blockhydrogen, and therefore the conductive metal oxide films 25 b are notreduced by hydrogen.

Moreover, the glue film is not limited to a film stack including atitanium film and a titanium nitride film. The glue film may be formedof a single-layer film made of any one of a titanium film, a titaniumnitride film, a tantalum nitride film, and a titanium aluminum nitridefilm, or a film stack including any thereof.

Furthermore, a tungsten film is formed on the glue film by CVD, wherebythe second and third holes 41 a and 41 b are fully filled with thistungsten film.

Then, unnecessary portions of the glue film and the tungsten film on thecap insulating film 43 are polished and removed by CMP in a way thatthese films are left only in the second and third holes 41 a and 41 b asfourth and fifth conductive plugs 47 a and 47 b.

Of these plugs, the fourth conductive plugs 47 a are electricallyconnected to the upper electrodes 25 a of the capacitors Q. On the otherhand, each of the fifth conductive plugs 47 b is electrically connectedto the corresponding second conductive plug 32 b, and constitutes partof a bit line together with the second conductive plug 32 b.

Here, if the titanium nitride films partially constituting the gluefilms of the fourth conductive plugs 47 a come into contact with theconductive metal oxide films 25 b partially constituting the upperelectrodes 25 a, there is a disadvantage that the contact resistancesbetween the upper electrodes 25 a and the fourth conductive plugs 47 abecome high. In view of this point, in this embodiment, theconductivity-improving films 25 c made of iridium are formed in theuppermost layers of the upper electrodes 25 a. Accordingly, the contactresistances between the upper electrodes 25 a and the fourth conductiveplugs 47 a can be made low.

Thereafter, as shown in FIG. 3W, a metal film stack is formed on the capinsulating film 43 and the conductive plugs 47 a and 47 b by sputtering,and this metal film stack is patterned to form metal interconnections 49a and a conductive pads 49 b for the bit lines.

As the metal film stack, a titanium film having a thickness of 60 nm, atitanium nitride film having a thickness of 30 nm, a copper-containingaluminum film having a thickness of 360 nm, a titanium film having athickness of 5 nm, and a titanium nitride film having a thickness of 70nm are formed in this order.

By the above-described steps, the basic structure of the semiconductordevice according to this embodiment is completed.

In this embodiment described above, as shown in FIG. 3H, the firstconductive film 23, which become the lower electrodes 23 a of thecapacitors, has a two-layer structure including the lower conductivelayer 23 b made of platinum and the upper conductive layer 23 c made ofiridium.

The proportion of iridium in the first conductive film 23 is thussmaller than in the case where the first conductive film 23 has asingle-layer structure formed of an iridium film. Accordingly, in thestep (see FIG. 3N) of simultaneously etching the first conductive film23 and the ferroelectric film 24, it becomes possible to reduce thenumber of iridium grains emitted from the first conductive film 23 intothe etching atmosphere. As a result, it is possible to reduce the numberof iridium grains adhering again to the side surfaces of the capacitordielectric films 24 a during the above-described etching, which in turnprevents leakage paths from being formed on the side surfaces of thecapacitor dielectric films 24 a due to the iridium grains. As a result,it is made possible to provide a semiconductor device including thehigh-quality capacitors Q.

From the viewpoint of reducing the number of iridium grains, a materialfor the lower conductive layer 23 b is not particularly limited as longas it is a noble metal other than iridium. This is because a noble metalother than iridium does not emit a large number of grains unlike iridiumeven when etched, and does not greatly affect the leakage currents ofthe capacitors. Additionally, the noble metal other than iridium isetched to a certain extent by the etchant used in the step ofwet-etching the second hard mask 27 a (FIG. 30). Accordingly, thescattered grains of the noble metal other than iridium are dissolved bythe wet etching when the hard mask 27 a is removed.

If focus is made only on reducing the iridium grains, one may considerthat single layer made of noble metal other than iridium, such asplatinum film, suffices for the first conductive film 23.

However, it is necessary that the first conductive film 23 has not onlya function as the lower electrodes of the capacitors but also thefunction of improving the crystallinity of the ferroelectric film 24 onthe first conductive film 23 by the crystallinity thereof. Since iridiumfilms are excellent in this function, it is preferable that the firstconductive film 23 have a two-layer structure and that an iridium filmbe formed in the upper conductive layer 23 c which is the uppermostlayer of the first conductive film 23, as in this embodiment.

It should be noted, however, that if the platinum film is formed as theupper most upper conductive layer 23 c, interdiffudion occurs betweenlead contained in the ferroelectric film 24 made of PZT and platinum.Such interdiffusion deteriorates the ferroelectric characteristics ofthe ferroelectric film 24, such as the remanent polarization chargeamount. For example, Japanese Unexamined Patent Application PublicationNo. 2000-91539 and Japanese Unexamined Patent Application PublicationNo. 2004-95638 have such a problem.

Furthermore, platinum is more expensive than other noble metals.Accordingly, from the viewpoint of preventing an increase inmanufacturing cost, it is also not preferable to form a platinum film asthe upper conductive layer 23 c.

For these reasons, it is preferable to select a conductive materialother than platinum as a material for the upper conductive layer 23 c.

With regard to the selection of materials respectively for the lower andupper conductive layers 23 b and 23 c, the same is true inundermentioned embodiments.

(3) Second Embodiment

FIGS. 4A to 4L are cross-sectional views of a semiconductor deviceaccording to a second embodiment of the present invention in the processof being manufactured. It should be noted that, in these drawings, thesame components as those described in the first embodiment are denotedby the same reference numerals as in the first embodiment and will notbe further described below.

In the step of FIG. 3C of the first embodiment, the third conductiveplugs 36 a are formed by polishing the glue film 35 and the plugconductive film 36 by CMP.

However, for the slurry used in the CMP, the polishing speeds of theglue film 35 and the plug conductive film 36 are faster than that of theunderlying insulating film 15. Thus, it is difficult to match theheights of the respective upper surfaces of the third conductive plugs36 a and the underlying insulating film 15 at the point in time when theCMP is finished.

For this reason, as shown in FIG. 4A, recesses 15 b are actually formedin the underlying insulating film 15 after the above-described CMP, andthe heights of the upper surfaces of the third conductive films 36 abecome lower than that of the underlying insulating film 15. The depthof each of the recesses 15 b is 20 to 50 nm, typically approximately 50nm.

However, if such recesses 15 b exist, the orientation of lowerelectrodes and capacitor dielectric films is disturbed, and the problemoccurs that ferroelectric characteristics of the capacitor dielectricfilms deteriorate.

To solve this problem, in this embodiment, the following steps areperformed.

First, as shown in FIG. 4B, ammonia plasma treatment is performed on theunderlying insulating film 15, whereby NH groups are bonded to oxygenatoms on the surface of the underlying insulating film 15.

In this ammonia plasma treatment, for example, a parallel-plate plasmatreatment system is used, which has a counter electrode at a distance ofapproximately 9 mm (350 mils) from the silicon substrate 1. While thesubstrate temperature is being maintained at 400° C. at a pressure of266 Pa (2 Torr), ammonia gas is supplied to the inside of a chamber at aflow rate of 350 sccm, and the treatment is performed by supplying ahigh-frequency power of 100 W at 13.56 MHz to the silicon substrate 1and a high-frequency power of 55 W at 350 kHz to the above-describedcounter electrode for 60 seconds.

Next, as shown in FIG. 4C, a titanium film is formed as a planarizationconductive film 50 on the underlying insulating film 15 and the thirdconductive plugs 36 a to a thickness of 100 to 300 nm, e.g.,approximately 100 nm. The recesses 15 b are fully filled with thisplanarization conductive film 50.

Deposition conditions for this planarization conductive film 50 are notparticularly limited. In this embodiment, a sputtering system is used inwhich the distance between the silicon substrate 1 and a titanium targetis set at 60 mm, and the planarization conductive film 50 is formed inan argon atmosphere at a pressure of 0.15 Pa by applying a sputtering DCpower of 2.6 kW for 35 seconds under conditions in which the substratetemperature is 20° C.

Moreover, before the planarization conductive film 50 is formed, NHgroups have been bonded to oxygen atoms on the surface of the underlyinginsulating film 15 by ammonia plasma treatment (FIG. 4B). For thisreason, titanium atoms deposited on the underlying insulating film 15are less prone to be captured by oxygen atoms. As a result, the titaniumatoms can freely move on the surface of the underlying insulating film15, and it becomes possible to form the planarization conductive film 50made of titanium which is strongly self-assembled in the (002)direction.

It should be noted that the planarization conductive film 50 is notlimited to a titanium film. Any one of a tungsten film, a silicon film,and a copper film may be formed as the planarization conductive film 50.

Thereafter, RTA in which the substrate temperature is set at 650° C. isperformed on the planarization conductive film 50 in a nitrogenatmosphere to nitride the planarization conductive film 50 made oftitanium, and thus the planarization conductive film 50 of titaniumnitride oriented in the (111) direction is formed.

Here, recessed portions are formed in the upper surface of theabove-described planarization conductive film 50, reflecting therecesses 15 b formed in the underlying insulating film 15 around thethird conductive plugs 36 a as described previously. However, if suchrecessed portions are formed, the crystallinity of a ferroelectric filmto be formed above the planarization conductive film 50 later maydeteriorate.

Accordingly, in this embodiment, as shown in FIG. 4D, the upper surfaceof the planarization conductive film 50 is polished and planarized byCMP, thus removing the above-described recessed portions. Slurry used inthis CMP is not particularly limited. In this embodiment, SSW2000manufactured by Cabot Microelectronics Corporation is used.

It should be noted that the thickness of the planarization conductivefilm 50 after CMP varies in the plane of the silicon substrate and amonga plurality of silicon substrates due to polishing error. In thisembodiment, in consideration of the variations, a target value of thethickness of the planarization conductive film 50 after CMP is set at 50to 100 nm, more preferably 50 nm, by controlling the polishing time.

After CMP is performed on the planarization conductive film 50 asdescribed above, crystals in the vicinity of the upper surface of theplanarization conductive film 50 are distorted due to polishing.However, if lower electrodes of capacitors are formed above theplanarization conductive film 50 in which crystals are thus distorted asdescribed above, the lower electrodes are affected by the distortion,and the crystallinity of the lower electrodes deteriorate. Consequently,ferroelectric characteristics of the ferroelectric films thereondeteriorate.

In order to avoid such a disadvantage, in the next step, as shown inFIG. 4E, the upper surface of the planarization conductive film 50 isexposed to an ammonia plasma so that the distortion of crystals of theplanarization conductive film 50 is not transferred to a film thereon.

Next, as shown in FIG. 4F, an iridium film is formed as a conductiveadhesive film 51 by sputtering on the planarization conductive film 50in which the distortion of crystals is eliminated by the above-describedammonia plasma treatment. The conductive adhesive film 51 functions as afilm for improving the adhesion strength between films formed thereonand thereunder. The thickness of the conductive adhesive film 51 ispreferably formed to be as small as possible, e.g., not more than 20 nm,more preferably 5 nm to 10 nm.

Subsequently, by performing the steps of FIGS. 3E to 3K described in thefirst embodiment, the crystalline conductive film 21 to the secondconductive film 25 are stacked as shown in FIG. 4G.

Subsequently, by performing the steps described using FIGS. 3L and 3M,the first mask material layer 26 and the second hard mask 27 a areformed on the second conductive film 25 as shown in FIG. 4H.

Next, as shown in FIG. 4I, the first mask material layer 26 is etchedusing the second hard mask 27 a as a mask, and thereby the first hardmask 26 a is formed.

Thereafter, portions of the second conductive film 25, the ferroelectricfilm 24, and the first conductive film 23, which are not covered withthe first and second hard masks 26 a and 27 a, are dry-etched, and thusthe capacitors Q each including the upper electrode 25 a, the capacitordielectric film 24 a and the lower electrode 23 a are formed.

In the etching, as in the first embodiment, a gas mixture of HBr andoxygen is used as etching gas for the first and second conductive films23 and 25, and a gas mixture of chlorine and argon is used as etchinggas for the ferroelectric film 24.

Here, the first conductive film 23 is formed of the lower conductivelayer 23 b made of platinum and the upper conductive layer 23 c made ofiridium as described in the first embodiment. Accordingly, the number ofiridium grains scattered from the first conductive film 23 during thisetching is reduced compared with that in a case where the entire firstconductive film 23 is formed of iridium. By this way, leakage paths areprevented from being formed by iridium adhering again to the sidesurfaces of the capacitor dielectric films 24 a, and it becomes possibleto reduce the leakage currents between the upper and lower electrodes 25a and 23 a.

Subsequently, as shown in FIG. 4J, the second hard mask 27 a made ofsilicon oxide is removed by wet etching using a mixed solution ofhydrogen peroxide, ammonia, and moisture as an etchant. It should benoted that the second hard mask 27 a may be removed by dry etching.

Next, steps for obtaining the cross-sectional structure shown in FIG. 4Kwill be described.

First, using the first hard mask 26 a (see FIG. 4J) as a mask, portionsof the conductive oxygen barrier film 22, the crystalline conductivefilm 21, the conductive adhesive film 51, and the planarizationconductive film 50 which protrude from the lower electrodes 23 a areetched in a way that these films are left only under the capacitors Q.This etching is performed by dry etching. As etching gas therefor, forexample, a gas mixture of argon and chlorine is used.

Moreover, the first hard mask 26 a is also etched by this etching gas.Accordingly, when the etching is finished, the first hard mask 26 a isremoved.

Thereafter, by performing the steps of FIGS. 3Q to 3W described in thefirst embodiment, the basic structure of the semiconductor deviceaccording to this embodiment such as shown in FIG. 4L is completed.

According to this embodiment described above, as described withreference to FIGS. 4C and 4D, the recesses 15 b formed around the thirdconductive plugs 36 a by CMP are filled with the planarizationconductive film 50, and further the planarization conductive film 50 isplanarized by CMP.

By this way, the flatness of the lower electrodes 23 a (see FIG. 4K)formed above the planarization conductive film 50 becomes favorable, andthe orientation of the lower electrodes 23 a becomes favorable.Additionally, the orientation of the capacitor dielectric films 24 a isalso improved by the action of the orientation of the lower electrodes23 a, and ferroelectric characteristics such as remanent polarizationcharge amounts of the capacitor dielectric films 24 a are improved.

Also, as in the first embodiment, the first conductive film 23 has atwo-layer structure including the lower and upper conductive films 23 band 23 c. Accordingly, in the step of simultaneously etching theferroelectric film 24 and the first conductive film 23 (FIG. 4I), thenumber of iridium grains scattered from the first conductive film 23 canbe reduced, and leakage paths can be prevented from being formed due tothe iridium grains.

(4) Third Embodiment

FIG. 5 is a cross-sectional view of a semiconductor device according tothis embodiment.

This embodiment differs from the second embodiment in the followingpoint. In this embodiment, in the CMP step of FIG. 4D, the planarizationconductive film 50 is removed from the upper surface of the underlyinginsulating film 15 in a way that the planarization conductive film 50 isleft only in the recesses 15 b. In other points, this embodiment and thesecond embodiment are the same.

Also in this embodiment, as the layer structure of each of the lowerelectrodes 23 a, a two-layer structure is employed, which includes thelower conductive layer 23 b made of platinum and the upper conductivelayer 23 c made of iridium.

Accordingly, for the same reason as described in the first embodiment,it is possible to reduce the number of iridium grains adhering again tothe side surfaces of the capacitor dielectric films 24 a when the lowerelectrodes 23 a are formed by etching. Accordingly, leakage paths due toiridium grains can be prevented from being formed in the capacitors Q.

(5) Fourth Embodiment

FIGS. 6A to 6O are cross-sectional views of a semiconductor deviceaccording to this embodiment in the process of being manufactured. Itshould be noted that in these drawings, the same components as thosedescribed in the first embodiment are denoted by the same referencenumerals as in the first embodiment and will not be further describedbelow.

At the beginning, steps for obtaining the cross-sectional structureshown in FIG. 6A will be described.

First, according to the step described with reference to FIG. 3A of thefirst embodiment, the cover insulating film 10 and the first interlayerinsulating film 11 are formed on the silicon substrate 1. Theseinsulating films are patterned, and thereby contact holes are formedrespectively over the first source/drain regions 8 a.

Moreover, a glue film and a tungsten film are formed in this order inthese contact holes. Then, unnecessary portions of the glue film and thetungsten film on the first interlayer insulating film 11 are polishedand removed by CMP in a way that these films are left only in thecontact holes as the first conductive plugs 32 a.

Next, as shown in FIG. 6B, a titanium film is formed on the firstinterlayer insulating film 11 and the first conductive plugs 32 a to athickness of approximately 20 nm. This titanium film is used as thecrystalline conductive film 21.

It should be noted that ammonia plasma treatment may be performed inadvance on the respective upper surfaces of the first interlayerinsulating film 11 and the first conductive plugs 32 a before thiscrystalline conductive film 21 is formed. By performing this ammoniaplasma treatment, titanium atoms deposited on the first interlayerinsulating film 11 become less prone to be captured by oxygen atoms onthe surface of the insulating film 11. Accordingly, the titanium atomscan freely move on the surface of the first interlayer insulating film11, and it becomes possible to form the crystalline conductive film 21made of titanium which is strongly self-assembled in the (002)direction.

Thereafter, RTA, in which the substrate temperature and the treatmenttime are set respectively at 650° C. and 60 seconds, is performed on thecrystalline conductive film 21 in a nitrogen atmosphere. Accordingly,the crystalline conductive film 21 made of titanium is nitrided, and thecrystalline conductive film 21 is made of titanium nitride oriented inthe (111) direction.

Furthermore, a titanium aluminum nitride film is formed as theconductive oxygen barrier film 22 on this crystalline conductive film 21to a thickness of 100 nm by reactive sputtering.

Subsequently, as shown in FIG. 6C, a platinum film is formed as thelower conductive layer 23 b of the first conductive film on theconductive oxygen barrier film 22 to a thickness of 60 nm by sputtering.The platinum film is formed, for example, in an argon atmosphere at apressure of 0.2 Pa by setting the substrate temperature at 400° C. andthe sputtering power at 0.5 kW.

It should be noted that a material for this lower conductive layer 23 bis not particularly limited as long as it is a noble metal other thaniridium, and the lower conductive layer 23 b may be formed of rhodium orpalladium.

Subsequently, an iridium film is formed on the lower conductive layer 23b to a thickness of 40 nm. This iridium film is used as the upperconductive layer 23 c of the first conductive film. Depositionconditions for this iridium film are not particularly limited. In thisembodiment, the following conditions are employed: an argon atmosphereat a pressure of 0.11 Pa, a substrate temperature of 500° C., and asputtering power of 0.3 kW.

Furthermore, a conductive material constituting the upper conductivelayer 23 c is not limited to iridium, and may be any one of ruthenium,iridium oxide, ruthenium oxide, and SrRuO₃.

By this way, the first conductive film 23 including the lower and upperconductive layers 23 b and 23 c is formed on the conductive barrier film22.

Subsequently, as shown in FIG. 6D, a PZT film is formed on the firstconductive film 23 by MOCVD. This PZT film is used as the firstferroelectric film 24 b.

The first ferroelectric film 24 b is not limited to a PZT film. A filmin which the crystal structure is changed to a Bi layered structure or aperovskite structure by heat treatment may be formed as the firstferroelectric film 24 b. Of these, films in which the crystal structureis changed to a perovskite structure include a PZT film doped with avery small amount of any one of lanthanum, calcium, strontium, andsilicon.

On the other hand, films in which the crystal structure is changed to aBi layered structure include a (Bi_(1-x)R_(x))Ti₃O₁₂ (R is a rare-earthelement, and 0<x<1) film, a SrBi₂Ta₂O₉ film, and a SrBi₄Ti₄O₁₅ film.

Subsequently, an amorphous PZT film is formed as the secondferroelectric film 24 c on the first ferroelectric film 24 b bysputtering. The first and second ferroelectric films 24 b and 24 c areused as the ferroelectric film 24.

The second ferroelectric film 24 c is not limited to a PZT film. Similarto the first ferroelectric film 24 b, a PZT film doped with a very smallamount of any one of lanthanum, calcium, strontium, and silicon may beformed as the second ferroelectric film 24 c. Alternatively, the secondferroelectric film 24 c may be formed of a material having a Bi layeredstructure such as (Bi_(1-x)R_(x))Ti₃O₁₂ (R is a rare-earth element, and0<x<1), SrBi₂Ta₂O₉, or SrBi₄Ti₄O₁₅.

Subsequently, as shown in FIG. 6E, by performing the step of FIG. 3Jdescribed in the first embodiment, the first and second conductive metaloxide films 25 d and 25 e both made of iridium oxide are formed on theferroelectric film 24. These conductive metal oxide films 25 d and 25 eare used as the conductive metal oxide film 25 d.

Furthermore, as shown in FIG. 6F, by performing the step of FIG. 3K ofthe first embodiment, the conductivity-improving film 25 c made ofiridium is formed on the conductive metal oxide film 25 b. By this way,the second conductive film 25 formed of the conductive metal oxide film25 b and the conductivity-improving film 25 c is formed on theferroelectric film 24.

Next, as shown in FIG. 6G, the first mask material layer 26 made oftitanium nitride is formed on the second conductive film 25 bysputtering.

Furthermore, a silicon oxide film is formed on the first mask materiallayer 26 by plasma CVD using TEOS gas, and the silicon oxide mask ispatterned to form the second hard mask 27 a.

Subsequently, as shown in FIG. 6H, the first mask material layer 26 isetched using the second hard mask 27 a as a mask, and thereby the firsthard mask 26 a is formed.

Subsequently, portions of the second conductive film 25, theferroelectric film 24, and the first conductive film 23 which are notcovered with the first and second hard masks 26 a and 27 a aredry-etched, and thus the capacitors Q each including the lower electrode25 a, the capacitor dielectric film 24 a and the upper electrode 23 a,are formed.

It should be noted that conditions for this dry etching have beendescribed with reference to FIG. 3N in the first embodiment andtherefore will not be further described.

In addition, even though the above-described dry etching is performed,the conductive oxygen barrier film 22 is left on the entire surface ofthe crystalline conductive film 21 without being etched.

Here, the first conductive film 23 is formed of the lower conductivelayer 23 b made of platinum and the upper conductive layer 23 c made ofiridium as described previously. Accordingly, the proportion of iridiumin the first conductive layer 23 is smaller compared with that in a casewhere the entire first conductive film 23 is formed of iridium. For thisreason, in this etching, it is possible to reduce the number of iridiumgrains scattered from the side surfaces of the lower electrodes 23 ainto the etching atmosphere, and to prevent leakage paths from beingformed on the side surfaces of the capacitor dielectric films 24 a bythe iridium grains.

Next, as shown in FIG. 6I, the second hard mask 27 a is removed by wetetching or dry etching. In the case of wet etching, a mixed solution ofhydrogen peroxide, ammonia, and moisture is used as an etchant.

Subsequently, steps for obtaining the cross-sectional structure shown inFIG. 6J will be described.

First, using the first hard mask 26 a (see FIG. 6I) as a mask and usinga gas mixture of argon and chlorine as etching gas, the crystallineconductive film 21 and the conductive oxygen barrier film 22 aredry-etched in a way that these films are left only under the capacitorsQ.

It should be noted that, since the first hard mask 26 a is also etchedby this etching gas, the first hard mask 26 a is removed when theetching is finished, and the upper surfaces of the upper electrodes 25 aare exposed.

Next, as shown in FIG. 6K, in order to protect the capacitors Q fromreducing substances such as hydrogen, an alumina film is formed as thefirst capacitor protection insulating film 39 over the entire uppersurface of the silicon substrate 1 to a thickness of approximately 20nm.

Then, in order to recover damage suffered by the capacitor dielectricfilms 24 a during the dry etching (see FIG. 6I) performed when thecapacitors Q are formed and during the deposition of the first capacitorprotection insulating film 39 by sputtering, recovery annealing isperformed on the capacitor dielectric films 24 a in an oxygen-containingatmosphere. With regard to conditions for this recovery annealing, thesubstrate temperature is set at a temperature of 550° C. to 700° C.,e.g., 650° C., in a furnace, and the recovery annealing is performed forapproximately 60 minutes.

Thereafter, an alumina film is formed on the first capacitor protectioninsulating film 39 to a thickness of approximately 20 nm by CVD. Thisalumina film is used as the second capacitor protection insulating film40.

Subsequently, as shown in FIG. 6L, a silicon oxide film is formed as thesecond interlayer insulating film 41 on the second capacitor protectioninsulating film 40 by plasma CVD using TEOS gas as reaction gas. In thereaction gas, oxygen gas and helium gas are also contained. In addition,the second interlayer insulating film 41 has a thickness of 1500 nm onthe flat surface of the silicon substrate 1.

It should be noted that, instead of the silicon oxide film, aninsulating inorganic film may be formed as the second interlayerinsulating film 41.

Thereafter, the surface of the second interlayer insulating film 41 ispolished and planarized by CMP.

Next, steps for obtaining the cross-sectional structure shown in FIG. 6Mwill be described.

First, the surface of the second interlayer insulating film 41 isexposed to a N₂O plasma, and thereby moisture remaining in the secondinterlayer insulating film 41 is removed and is prevented from beingreabsorbed by the second interlayer insulating film 41.

It should be noted that N₂ plasma treatment may be performed as thisdehydrating treatment.

Subsequently, the cover insulating film 10, the first and secondinterlayer insulating films 11 and 41, and the first and secondcapacitor protection insulating films 39 and 40 are patterned, andthereby a first holes 41 c are formed in these insulating films over thesecond source/drain regions 8 b.

Furthermore, a glue film and a tungsten film are formed in this order ineach of these first holes 41 c. Then, unnecessary portions of the gluefilm and the tungsten film on the second interlayer insulating film 41are polished and removed by CMP in a way that these films are left onlyin the first hole 41 c as a second conductive plug 54.

The second conductive plug 54 constitutes part of a bit line and iselectrically connected to the second source/drain region 8 b.

The second conductive plug 54 consists primarily of tungsten prone to beoxidized, and is therefore prone to cause a contact failure if oxidizedin the process.

For this reason, in order to prevent the oxidation of the secondconductive plug 54, a silicon oxynitride film is formed on therespective upper surfaces of the second interlayer insulating film 41and the second conductive plug 54 to a thickness of approximately 100nm. This silicon oxynitride film is used as an anti-oxidation insulatingfilm 55.

Next, as shown in FIG. 6N, the first and second capacitor protectioninsulating films 39 and 40, the second interlayer insulating film 41,and the anti-oxidation insulating film 55 are patterned, and therebysecond holes 41 d are formed in these films on the upper electrodes 25a.

After these second holes 41 d are formed, in order to recover damagesuffered by the capacitor dielectric films 24 a in the steps describedso far, annealing may be performed in an oxygen-containing atmosphere.Even if annealing is thus performed, the oxidation of the secondconductive plug 54 is prevented by the anti-oxidation insulating film55.

Thereafter, the anti-oxidation insulating film 55 is etched back to beremoved.

Subsequently, as shown in FIG. 6O, a metal film stack is formed on therespective upper surfaces of the second interlayer insulating film 41and the second conductive plug 54 by sputtering, and this metal filmstack is patterned to form metal interconnections 57 a and a conductivepad 57 b for the bit line.

The metal film stack is made by, for example, forming a titanium filmhaving a thickness of 60 nm, a titanium nitride film having a thicknessof 30 nm, a copper-containing aluminum film having a thickness of 400nm, a titanium film having a thickness of 5 nm, and a titanium nitridefilm having a thickness of 70 nm in this order.

By the above-described steps, the basic structure of the semiconductordevice according to this embodiment is completed.

In this embodiment described above, the third conductive plugs 36 a andthe underlying insulating film 15 of the first embodiment are notformed. Accordingly, the process can be simplified compared with that ofthe first embodiment.

Furthermore, the second conductive plug 54 constituting part of the bitline over the second source/drain region 8 b includes only a singlelayer. Accordingly, a simpler structure is obtained, which is simplerthan that in the first embodiment in which two layers of conductiveplugs 32 b and 47 b are formed.

Also, as in the first embodiment, a two-layer structure including thelower conductive layer 23 b made of platinum and the upper conductivelayer 23 c made of iridium is employed as the layer structures of thelower electrodes 23 a to reduce the proportion of iridium in the lowerelectrodes 23 a. Accordingly, in the step of forming the capacitors Q bysimultaneous etching (FIG. 6H), it is possible to reduce the number ofiridium grains scattered from the side surfaces of the lower electrodes23 a into the etching atmosphere, and to prevent leakage paths frombeing formed by the iridium grains.

(6) Fifth Embodiment

FIGS. 7A to 7N are cross-sectional views of a semiconductor deviceaccording to this embodiment in the process of being manufactured. FIGS.8A to 8J are plan views thereof.

In this embodiment, a description on a planar FeRAM will be given.

First, steps for obtaining the cross-sectional structure shown in FIG.7A will be described. In a surface of an n- or p-type silicon substrate61, an element isolation insulating film 26 is formed by local oxidationof silicon (LOCOS). For forming the element isolation insulating film62, shallow trench isolation (STI) may be also employed. After such anelement isolation insulating film 62 is formed, a p-well 63 is formed ina predetermined active area in a memory cell region of the siliconsubstrate 61.

Thereafter, the surface of the active area of the silicon substrate 61is thermally oxidized to form a silicon oxide film. This silicon oxidefilm is used as gate insulating films 64. Next, a conductive film madeof polycrystalline silicon or refractory metal silicide is formed overthe entire upper surface of the silicon substrate 61. Then, theconductive film is patterned into predetermined shapes byphotolithography, and thus gate electrodes 65 a and 65 b are formed. Onone p-well 63 in the memory cell region, two gate electrodes 65 a and 65b are arranged approximately in parallel. These gate electrodes 65 a and65 b constitute portions of word lines.

Subsequently, ions of an n-type impurity are implanted into the p-well63 on both sides of the gate electrodes 65 a and 65 b, and thus n-typeimpurity diffusion regions 66 a and 66 b are formed, which respectivelybecome sources and drains of n-channel MOS transistors. Furthermore, aninsulating film is formed over the entire surface of the siliconsubstrate 61, and then the insulating film is etched back to be left asinsulating sidewalls 67 on both side surfaces of the gate electrodes 65a and 65 b. The insulating film is, for example, silicon oxide formed byCVD.

Furthermore, using the gate electrodes 65 a and 65 b and the insulatingsidewalls 67 as a mask, ions of an n-type impurity are again implantedinto the p-well 63, whereby the n-type impurity diffusion regions 66 aand 66 b have lightly doped drain (LDD) structures. It should be notedthat, in one p-well 63, the n-type impurity diffusion region 66 bsandwiched between the two gate electrodes 65 a and 65 b is electricallyconnected to a bit line described later, and the two impurity diffusionregions 66 a near both ends of the p-well 63 are electrically connectedto capacitor upper electrodes described later.

As described above, in the p-well 63 of the memory cell region, the gateelectrodes 65 a and 65 b, the n-type impurity diffusion regions 66 a and66 b, and the like constitute two n-type MOS transistors TR₁ and TR₂,and the planar structure of a memory cell such as shown in FIG. 8A isobtained. It should be noted, however, that the insulating sidewalls 67are omitted in the plan view. Next, a refractory metal film is formedover the entire surface. Then, this refractory metal film is heated toform refractory metal silicide layers 68 a and 68 b respectively on thesurfaces of the n-type impurity diffusion regions 66 a and 66 b.Thereafter, unreacted portions of the refractory metal film are removedby wet etching.

Additionally, a silicon oxynitride film is formed as a cover insulatingfilm 69 over the entire surface of the silicon substrate 61 to athickness of approximately 200 nm by plasma CVD. Moreover, a siliconoxide film is grown as a first interlayer insulating film 70 on thecover insulating film 69 to a thickness of approximately 1.0 μm byplasma CVD using TEOS gas. Subsequently, the first interlayer insulatingfilm 70 is polished by CMP to planarize the upper surface thereof.

Next, steps for obtaining the cross-sectional structure shown in FIG. 7Bwill be described.

First, a platinum film is formed on the first interlayer insulating film70 to a thickness of approximately 100 nm by sputtering. This platinumfilm is used as a lower conductive layer 71 b of a first conductivefilm.

Furthermore, an iridium film is formed as a second conductive layer 71 con the lower conductive layer 71 b to a thickness of approximately 75 nmby sputtering.

Accordingly, the lower and upper conductive layers 71 b and 71 c formedas described above constitute a first conductive film 71 as shown inFIG. 7B.

It should be noted that, in order to improve the adhesion between thefirst conductive film 71 and the first interlayer insulating film 70,any one of a titanium film, an alumina film, an aluminum nitride film, atitanium aluminum nitride film, a tantalum oxide film, a titanium oxidefilm, and a zirconium oxide film may be formed therebetween as anadhesive film.

Next, as shown in FIG. 7C, a PZT film is formed on the first conductivefilm 71 to a thickness of 100 to 300 nm by MOCVD. This PZT film is usedas a ferroelectric film 72.

Methods of forming the ferroelectric film 72 include the spin-on method,the sol-gel method, and metal organic deposition (MOD), other than theabove-described MOCVD. A material for the ferroelectric film 72 may bePLZT, a bismuth layered compound, or the like, other than PZT.

After such a ferroelectric film 72 is formed, an iridium oxide film isformed thereon as a second conductive film 73 to a thickness of 150 to250 nm by sputtering.

It should be noted that, in order to improve electric characteristics ofcapacitors, a film stack including a conductive metal oxide film and aconductivity-improving film may be formed as the second conductive film73 as in the first embodiment.

The memory cell in a state in which this second conductive film 73 isformed has the planar structure shown in FIG. 8B.

Subsequently, as shown in FIG. 7D, resist is applied over the secondconductive film 73 to be exposed and developed. Accordingly, a firstresist pattern 74 having the shapes of upper electrodes is formed.

Next, as shown in FIGS. 7E and 8C, the second conductive film 73 isetched using the first resist pattern 74 as a mask, and then, theremaining portions of the second conductive film 73 are used as upperelectrodes 73 a of the capacitors.

Subsequently, as shown in FIG. 7F, the first resist pattern 74 isremoved to expose the capacitor upper electrodes 73 a. Thereafter, theferroelectric film 72 is annealed in an oxygen atmosphere through thecapacitor upper electrodes 73 a under the following conditions: atemperature of 650° C. and an annealing time of 60 minutes. Thisannealing is performed in order to recover damage suffered by theferroelectric film 72 during sputtering and etching.

Next, resist is applied over the upper electrodes 73 a and theferroelectric film 72 to be exposed and developed, and thus a secondresist pattern 75 is formed as shown in FIGS. 7G and 8D. The secondresist pattern 75 has a striped shape. Each stripe in the shape passesover a plurality of upper electrodes 73 a arranged in line in adirection in which the gate electrodes 65 a and 65 b extend, and alsohas a width equivalent to that of each of the upper electrodes 73 a.

Thereafter, as shown in FIGS. 7H and 8E, the ferroelectric film 72 isetched using the second resist pattern 75 as a mask. At this time,etching conditions are set so that the second resist pattern 75 can beappropriately set back, whereby by-products are prevented from adheringto sidewalls of the capacitors. The setback amount of the resist iscontrolled by adding gas reactive with the resist, e.g., chlorine gas,to process gas, or adjusting pressure or bias power.

During the etching of the ferroelectric film 72, the second resistpattern 75 is set back, portions near both side edges of the upperelectrodes 73 a are exposed, and upper portions of both of the sideedges are etched. The exposed portions function as a mask for theferroelectric film 72, and, at the point in time when the etching of theferroelectric film 72 is finished, both sides of each of the upperelectrodes 73 a are also left to have thicknesses sufficientlyappropriate to the mask properties.

The ferroelectric film 72 patterned into a striped shape using the upperelectrodes 73 a as part of a mask as described above is used ascapacitor dielectric films 72 a. Then, after the second resist pattern75 is removed, the capacitor dielectric films 72 a are annealed in anoxygen atmosphere at a temperature of 650° C. for 60 minutes. The planarstate after the second resist pattern 75 is removed becomes as shown inFIG. 8F.

Next, as shown in FIGS. 7I and 8G, an alumina film is formed as acapacitor protection insulating film 77 on the upper electrodes 73 a,the capacitor dielectric films 72 a, and the first conductive film 71 toa thickness of 50 nm by sputtering at room temperature. This capacitorprotection insulating film 77 is formed in order to protect thecapacitor dielectric films 72 a prone to reduction from hydrogen. As thecapacitor protection insulating film 77, a PZT film, a PLZT film, or atitanium oxide film may be formed. It should be noted that the capacitorprotection insulating film 77 is omitted in FIG. 8G.

Thereafter, the capacitor dielectric films 72 a under the capacitorprotection insulating film 77 is subjected to rapid heat treatment in anoxygen atmosphere under the following conditions: 700° C., 60 seconds,and a temperature rise rate of 125° C./sec. By this way, the quality ofthe capacitor dielectric films 72 a is improved. Next, resist is appliedover the capacitor protection insulating film 77 to be exposed anddeveloped, whereby a third resist pattern 76 having a striped shape inwhich each stripe is longer than the capacitor dielectric films 72 a andhas a width equivalent to that of each of the upper electrodes 73 a isformed along and over the capacitor dielectric films 72 a.

Thereafter, as shown in FIGS. 7J and 8H, the first conductive film 71and the capacitor protection insulating film 77 are dry-etched using thethird resist pattern 76 as a mask. The striped first conductive film 71left under the third resist pattern 76 is thus used as lower electrodes71 a. In a planar FeRAM, the lower electrodes 71 a are also referred toas plate lines.

In the dry etching, a gas mixture of chlorine gas and argon gas is usedas etching gas. Side surfaces of the third resist pattern 76 areappropriately set back due to damage from the etching gas converted intoa plasma.

Thus, during the etching of the first conductive film 71 and thecapacitor protection insulating film 77, upper portions near both sideedges of the upper electrodes 73 a are exposed to be etched. The exposedportions function as a mask, and, at the point in time when the etchingof the first conductive film 71 is finished, the upper electrodes 73 aare left to have thicknesses sufficiently appropriate to maskproperties, e.g., thicknesses of 20 nm.

Here, during the etching of the first conductive film 71, iridium grainsare scattered into the etching atmosphere from the upper conductivelayer 71 c, which partially constitutes the first conductive film 71,and which is made of iridium. It should be noted, however, that in thisembodiment, since each of the lower electrodes 71 a has a two-layerstructure including the lower and upper conductive layers 71 b and 71 cto reduce the proportion of iridium in the lower electrodes 71 a as inthe first to fourth embodiments. Accordingly, the amount of theabove-described scattered iridium grains can be reduced compared withthat in a case where the entire lower electrodes 71 a are formed ofiridium. As a result, leakage paths can be prevented from being formedbetween the lower and upper electrodes 71 a and 73 a by iridium grainsagain adhering to the side surfaces of the capacitor dielectric films 72a.

The planar structure after this step is finished becomes as shown inFIG. 8H. A plurality of upper electrodes 73 a are formed on onecapacitor dielectric film 72 a having the shape of a striped shape, andthe lower electrode 71 a under the capacitor dielectric film 72 a islonger than the capacitor dielectric film 72 a. Accordingly, on thefirst interlayer insulating film 70, capacitors Q each including thelower electrode 71 a, the capacitor dielectric film 72 a, and thecapacitor upper electrode 73 a are formed as many as the capacitor upperelectrodes 73 a.

Then, after the third resist pattern 76 is removed, the capacitordielectric films 72 a are annealed in an oxygen atmosphere under thefollowing conditions: a temperature of 650° C. and an annealing time of60 minutes. By this annealing, the capacitor dielectric films 72 a arecaused to recover from damage.

Next, as shown in FIG. 7K, a silicon oxide film having a thickness of1200 nm is formed as a second interlayer insulating film 78 on thecapacitors Q and the first interlayer insulating film 70 by CVD. Then,the surface of the second interlayer insulating film 78 is planarized byCMP. The growth of the second interlayer insulating film 78 may beperformed using silane or TEOS gas as reaction gas. The surface of thesecond interlayer insulating film 78 is planarized until the thicknessthereof becomes 200 nm from the upper surfaces of the capacitor upperelectrodes 73 a.

Next, steps for forming the structure shown in FIGS. 7L and 8I will bedescribed. First, the first and second interlayer insulating films 70and 78 and the cover insulating film 69 are patterned, and thus contactholes 78 a, 78 b and 78 c are formed over the n-type impurity diffusionregions 66 a and 66 b and the lower electrodes 71 a. As etching gas forthe first and second interlayer insulating films 70 and 78 and the coverinsulating film 69, CF-based gas, e.g., a gas mixture made by adding Arto CF₄ gas, is used. It should be noted that the contact holes 78 cformed on the lower electrodes 71 a are not shown in the cross-sectionalview but represented by forming positions in FIG. 8I.

Next, a titanium film having a thickness of 20 nm and a titanium nitridefilm having a thickness of 50 nm are formed on the upper surface of thesecond interlayer insulating film 75 and the inner surfaces of thecontact holes 78 a, 78 b, and 78 c by sputtering. These films are usedas a glue film. Furthermore, a tungsten film is formed on this glue filmby CVD, whereby the contact holes 78 a, 78 b and 78 c are fully filledwith the tungsten film.

Furthermore, the tungsten film and the glue film on the secondinterlayer insulating film 75 are removed by CMP to leave these filmsonly in the contact holes 78 a, 78 b, and 78 c. The tungsten film andthe glue film in the contact holes 78 a, 78 b and 78 c are thus used asconductive plugs 79 a and 79 b. It should be noted that in one p-well 73of the memory cell region, the first conductive plug 79 b over thecenter n-type impurity diffusion region 66 b sandwiched between the twogate electrodes 65 a and 65 b is electrically connected to a bit linedescribed later, and the two second conductive plugs 78 a on both sidesof the first conductive plug 79 b are electrically connectedrespectively to the upper electrodes 73 a through interconnectionsdescribed later.

FIG. 8J is a plan view after this step is finished.

In this step, as shown in FIG. 8J, third conductive plugs 79 celectrically connected respectively to the lower electrodes 71 a areformed in the corresponding contact holes 78 c formed in regions(contact regions CR) of the lower electrodes 71 a in which the lowerelectrodes 71 a protrude from edges of the capacitor dielectric films 72a.

Thereafter, the second interlayer insulating film 78 is heated in avacuum chamber at a temperature of 390° C. to expel moisture to theoutside.

Next, steps for obtaining the cross-sectional structure shown in FIG. 7Mwill be described.

First, a silicon oxynitride film is formed as an anti-oxidationinsulating film 80 on the second interlayer insulating film 78 and theconductive plugs 79 a and 79 b to a thickness of, for example, 100 nm byplasma CVD. This silicon oxynitride film is formed using a gas mixtureof silane and N₂O.

Subsequently, the capacitor protection insulating film 77, the secondinterlayer insulating film 78, and the anti-oxidation insulating film 80are patterned by photolithography, and thus holes 80 a on the upperelectrodes 73 a are formed. Thereafter, the capacitor dielectric films72 a are annealed in an oxygen atmosphere under the followingconditions: 550° C. and 60 minutes. Accordingly, the quality of thecapacitor dielectric films 72 a is improved. In this case, the oxidationof the conductive plugs 79 a and 79 b is prevented by the anti-oxidationinsulating film 80.

Next, steps for forming the structure shown in FIG. 7N will bedescribed. First, the anti-oxidation insulating film 80 is removed bydry etching using CF-based gas. Then, the respective surfaces of theconductive plugs 79 a and 79 b and the upper electrodes 73 a are etchedto a depth of approximately 10 nm by RF etching to expose cleansurfaces. Thereafter, a four-layer conductive film containing aluminumis formed on the second interlayer insulating film 78, the conductiveplugs 79 a and 79 b, and the holes 80 a by sputtering. The conductivefilm includes a titanium nitride film having a thickness of 50 nm, acopper-containing aluminum film having a thickness of 500 nm, a titaniumfilm having a thickness of 5 nm, and a titanium nitride film having athickness of 100 nm in this order from bottom to top.

Then, the multilayer conductive film is patterned by photolithography toform a via contact pad 81 b on the conductive plug 79 b in the center ofthe p-well 63, and to form metal interconnections 81 a having shapeswhich connect the upper surfaces of the conductive plugs 79 arespectively on both sides of the conductive plug 79 b to the uppersurfaces of the upper electrodes 73 a. Accordingly, the upper electrodes73 a are connected respectively to the n-type impurity diffusion regions66 a near both ends of the p-well 63 through the metal interconnections81 a, the conductive plugs 79 a, and the refractory metal silicidelayers 68 a. It should be noted that other interconnections (not shown)are also formed on conductive plugs (not shown) formed in the contactholes 78 c (see FIG. 8I) on the lower electrodes 71 a.

Subsequently, a silicon oxide film is formed as a third interlayerinsulating film 82 to a thickness of 2300 nm by plasma CVD using TEOSgas, whereby the second interlayer insulating film 78, the metalinterconnections 81 a, the contact pad 81 b, and the like are coveredwith the third interlayer insulating film 82. Then, the surface of thethird interlayer insulating film 82 is planarized by CMP. Furthermore, aprotection insulating film 83 made of silicon oxide is formed on thethird interlayer insulating film 82 by plasma CVD using TEOS gas.Thereafter, the third interlayer insulating film 82 and the protectioninsulating film 83 are patterned, thus forming a hole 82 a on thecontact pad 81 b over the center of the p-well 63 of the memory cellregion.

Next, a glue film 84, which is made of titanium nitride, and which has athickness of 90 nm to 150 nm, is formed on the upper surface of theprotection insulating film 83 and the inner surface of the hole 82 a bysputtering, and a tungsten film 85 is then formed by CVD to fill thehole 82 a. Subsequently, this tungsten film 85 is etched back to be leftonly in the hole 82 a. The tungsten film 85 left in the hole 82 a isused as a second-layer conductive plug.

Thereafter, a metal film is formed on the glue film 84 and the tungstenfilm 85 by sputtering. Then, the metal film is patterned byphotolithography, thus forming a bit line 86 electrically connected tothe n-type impurity diffusion region 66 b through the second-layerconductive plug, the contact pad 81 b, the first-layer conductive plug80 b, and the refractory metal silicide layer 68 b.

By the above-described steps, the basic structure of the semiconductordevice according to this embodiment is completed.

In this embodiment, the second and third resist patterns 76 and 77 areset back from the side thereof during the etching of the ferroelectricfilm 72 or the first conductive film 71. Accordingly, both shoulderportions of the upper electrodes 73 a are exposed to be partiallyetched. Since the exposed portions function as an etching mask for theferroelectric film 72 and the first conductive film 71, the patterningof the ferroelectric film 72 and the first conductive film 71 arefavorably performed. Thus, side surfaces of the upper electrodes 73 a,the side surfaces of the capacitor dielectric films 72 a, and the sidesurfaces of the lower electrodes are approximately in the same plane.

Furthermore, as the layer structure of the first conductive film 71, atwo-layer structure is employed which includes the lower conductivelayer 71 b made of platinum and the upper conductive layer 71 c made ofiridium. Accordingly, the proportion of iridium in the first conductivefilm 71 is reduced. As a result, in the step of forming the lowerelectrodes 71 a by etching (FIG. 7J), the number of iridium grainsscattered from the side surfaces of the lower electrodes 71 a into theetching atmosphere is reduced. Accordingly, leakage paths can beprevented from being formed on the side surfaces of the capacitordielectric films 72 a by iridium grains, and the leakage currents of thecapacitors Q can be reduced.

As described above, according to the present invention, by giving atwo-layer structure including lower and upper conductive layers to afirst conductive film, which becomes a lower electrode of a capacitor,the proportion of a material for the upper conductive layer in the firstconductive film is reduced. Accordingly, it is possible to prevent thematerial for the upper conductive layer from being scattered as grainsduring the patterning of the lower electrodes, and the leakage currentof the capacitor can be prevented from being increased by the grains ofthe material again adhering to side surfaces of capacitor dielectricfilms.

1. A semiconductor device comprising: a first interlayer insulating filmformed over a semiconductor substrate; a lower electrode formed over thefirst interlayer insulating film; a capacitor dielectric film formed onthe lower electrode and made of a ferroelectric material; and an upperelectrode formed on the capacitor dielectric film, wherein the lowerelectrode comprises a lower conductive layer and an upper conductivelayer, the lower conductive layer being made of a noble metal other thaniridium, the upper conductive layer being formed on the lower conductivelayer and made of a conductive material, which is different from amaterial for the lower conductive layer, and which is other thanplatinum.
 2. The semiconductor device according to claim 1, wherein thenoble metal constituting the lower conductive layer is any one ofplatinum, rhodium and palladium.
 3. The semiconductor device accordingto claim 1, wherein the conductive material constituting the upperconductive layer is any one of iridium, ruthenium, iridium oxide,ruthenium oxide and SrRuO₃.
 4. The semiconductor device according toclaim 1, wherein the lower conductive layer is thicker than the upperconductive layer.
 5. The semiconductor device according to claim 1,further comprising a first impurity diffusion region formed in thesemiconductor substrate, wherein a first hole is formed in the firstinterlayer insulating film over the first impurity diffusion region, afirst conductive plug electrically connected to the first impuritydiffusion region is formed in the first hole, and the lower electrode isformed over the first conductive plug to be electrically connected tothe first conductive plug.
 6. The semiconductor device according toclaim 5, further comprising: an underlying insulating film formed overthe first interlayer insulating film, the underlying insulating filmhaving a second hole formed on the first conductive plug; a secondconductive plug formed in the second hole, and electrically connected tothe first conductive plug; and a planarization conductive film formed onthe second conductive plug and the underlying insulating film around thesecond conductive plug, wherein the lower electrode is formed on theplanarization conductive film.
 7. The semiconductor device according toclaim 5, further comprising: a second impurity diffusion region formedin the semiconductor substrate; a third conductive plug formed in athird hole provided in the first interlayer insulating film over thesecond impurity diffusion region, the third conductive plug beingelectrically connected to the second impurity diffusion region; a secondinterlayer insulating film covering a capacitor; and a fourth conductiveplug formed in a fourth hole provided in the second interlayerinsulating film over the third conductive plug, the fourth conductiveplug being electrically connected to the third conductive plug.
 8. Amethod of manufacturing a semiconductor device, comprising the steps of:forming a first interlayer insulating film over a semiconductorsubstrate; forming a first conductive film over the first interlayerinsulating film; forming a ferroelectric film on the first conductivefilm; forming a second conductive film on the ferroelectric film;forming an upper electrode of a capacitor by patterning the secondconductive film; forming a capacitor dielectric film by patterning theferroelectric film; and forming a lower electrode of the capacitor bypatterning the first conductive film, wherein the step of forming thefirst conductive film comprises the steps of: forming a lower conductivelayer made of a noble metal other than iridium over the first interlayerinsulating film; and forming an upper conductive layer on the lowerconductive layer, the upper conductive layer being made of a conductivematerial, which is different from a material for the lower conductivelayer, and which is other than platinum.
 9. The method according toclaim 8, wherein in the step of forming the lower conductive layer, thelower conductive layer is formed thicker than the upper conductivelayer.
 10. The method according to claim 8, wherein in the step offorming the lower conductive layer, a platinum film is formed as thelower conductive layer by sputtering at a substrate temperature of notless than 250° C. nor more than 450° C., and in the step of forming theupper conductive layer, an iridium film is formed as the upperconductive layer by sputtering at a substrate temperature of not lessthan 400° C. nor more than 550° C.
 11. The method according to claim 8,wherein after the upper conductive layer is formed, the first conductivefilm is annealed in an inert gas atmosphere.
 12. The method according toclaim 8, wherein any one of platinum, rhodium and palladium is employedas the noble metal constituting the lower conductive layer.
 13. Themethod according to claim 8, wherein any one of iridium, ruthenium,iridium oxide, ruthenium oxide and SrRuO₃ is employed as the conductivematerial constituting the upper conductive layer.
 14. The methodaccording to claim 8, further comprising the steps of: forming a firstimpurity diffusion region and a second impurity diffusion region in thesemiconductor substrate; forming a first hole in the first interlayerinsulating film over the first impurity diffusion region; and forming afirst conductive plug in the first hole, wherein, in the step of formingthe lower electrode, the lower electrode is formed over the firstconductive plug, and the lower electrode and the first conductive plugare electrically connected to each other.
 15. The method according toclaim 14, further comprising the steps of: forming an underlyinginsulating film on the first interlayer insulating film and the firstconductive plug; forming a second hole in the underlying insulating filmon the first conductive plug; forming a second conductive plug in thesecond hole, the second conductive plug being electrically connected tothe first conductive plug; forming a crystalline conductive film on theunderlying insulating film and the second conductive plug; and forming aconductive oxygen barrier film on the crystalline conductive film,wherein, in the step of forming the first conductive film, the firstconductive film is formed on the conductive oxygen barrier film.
 16. Themethod according to claim 15, further comprising the steps of: afterforming the second conductive plug, forming a planarization conductivefilm on the second conductive plug and the underlying insulating film;and planarizing the planarization conductive film, wherein, in the stepof forming the crystalline conductive film, the crystalline conductivefilm is formed on the planarization conductive film.
 17. The methodaccording to claim 15, further comprising the steps of: forming a thirdhole in the first interlayer insulating film over the second impuritydiffusion region; forming a third conductive plug in the third hole;before forming the underlying insulating film, forming an anti-oxidationinsulating film, in which the second hole is to be formed, on the firstinterlayer insulating film, the first conductive plug and the thirdconductive plug; after forming the capacitor, forming a secondinterlayer insulating film covering the capacitor; forming a fourth holein the anti-oxidation insulating film, the underlying insulating film,and the second interlayer insulating film on the third hole; and forminga fourth conductive plug in the fourth hole, the fourth conductive plugbeing electrically connected to the third conductive plug.
 18. Themethod according to claim 8, wherein in the step of forming thecapacitor dielectric film and the step of forming the lower electrode,the ferroelectric film and the first conductive film are etched usingthe same mask, and thereby portions of the ferroelectric film and thefirst conductive film, which are left without being etched in regionsnot covered with the mask, are formed into the capacitor dielectric filmand the lower electrode, respectively.
 19. The method according to claim8, wherein in the step of patterning the first conductive film, thefirst conductive film is patterned in a way that a contact region of thelower electrode protrudes from the capacitor dielectric film, the methodfurther comprising the steps of: forming a second interlayer insulatingfilm covering the capacitor; forming a first hole in the secondinterlayer insulating film on the contact region; forming a second holein the second interlayer insulating film on the upper electrode; forminga conductive plug in the first hole, the conductive plug beingelectrically connected to the lower electrode; and forming a metalinterconnection in the second hole, the metal interconnection beingelectrically connected to the upper electrode.
 20. The method accordingto claim 19, wherein the step of patterning the first conductive filmcomprises the steps of: forming a resist pattern on the upper electrode;and etching the first conductive film in a region where the firstconductive film is exposed from the resist pattern.